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Metallization method for blind hole of printed circuit board

A printed circuit board and metallization technology is applied in the field of preparation and metallization of blind holes of high-density printed circuit boards. Simple, cost saving, high efficiency

Inactive Publication Date: 2015-08-19
UNIV OF ELECTRONICS SCI & TECH OF CHINA +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since electroless copper plating uses toxic formaldehyde as a reducing agent, it is difficult to treat residual formaldehyde in waste liquid, and the maintenance cost of electroless plating solution is high and the cost of colloidal palladium is expensive, which makes the overall cost of blind hole metallization method of electroless copper plating combined with electroplating copper High, complicated process and not environmentally friendly
The method of adsorbing a thin conductive carbon layer is to adsorb carbon black on the hole wall by ultrasonic waves, but the formation of a conductive carbon layer requires high consumption and stability of the carbon black solution, which is not conducive to the low-cost manufacturing of high-density printed circuit boards

Method used

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  • Metallization method for blind hole of printed circuit board
  • Metallization method for blind hole of printed circuit board
  • Metallization method for blind hole of printed circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] This example realizes the metallization of the blind hole of the printed circuit board with an aperture of 0.15mm.

[0028] CO 2 The laser drilling machine makes printed circuit board blind holes with an aperture of 0.15mm. After the blind holes have been subjected to surface grinding and wall cleaning, CO with a power of 5600kw, a frequency of 100Hz and a pulse width of 4ms is used. 2 The laser beam hits the copper surface at the bottom of the blind hole, which induces sputtering of copper particles and is adsorbed to the hole wall. Finally, the whole board is electroplated in the electroplating cylinder of the vertical DC electroplating line. Micro-etching treatment cannot be performed in the pre-plating process to prevent the hole wall Adsorbed copper particles are microetched away. The electroplating parameters are set to: current density 12A / dm 2 , Plating time 105min. After the electroplating process is completed, copper is plated in the observation hole of the...

Embodiment 2

[0030] This example realizes the metallization of the blind hole of the printed circuit board with an aperture of 0.115mm.

[0031] CO 2 The laser drilling machine makes blind holes of printed circuit boards with an aperture of 0.115mm. After the blind holes are treated with surface grinding and blind hole wall cleaning, CO with a power of 5600kw, a frequency of 100Hz, and a pulse width of 4ms 2 The laser beam hits the copper surface at the bottom of the blind hole, which induces sputtering of copper particles and is adsorbed to the hole wall. Finally, the whole board is electroplated in the electroplating cylinder of the vertical DC electroplating line. Micro-etching treatment cannot be performed in the pre-plating process to prevent the hole wall Adsorbed copper particles are microetched away. The electroplating parameters are set to: current density 12A / dm 2 , Plating time 105min. After the electroplating process is completed, copper is plated in the observation hole of ...

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Abstract

The invention relates to a method for metalizing a blind hole of a printed circuit board, belonging to the technical field of printed circuit board manufacture. The method comprises the following steps of utilizing CO2 lasers to burn copper foil at the bottom of the blind hole, utilizing the CO2 lasers to directly induce copper particles to be adsorbed at the hole wall of the blind hole, and then electroplating to realize blind hole metallization. The method has the characteristics of simplicity in blind hole manufacturing process, high efficiency, low cost and no environmental pollution, and the obtained blind hole has high reliability.

Description

technical field [0001] The invention belongs to the technical field of printed circuit board manufacturing, and relates to a method for preparing blind holes of a high-density printed circuit board and a metallization method. Background technique [0002] The rapid development of electronic information products represented by smart phones, ultra-thin notebooks, tablet computers and digital cameras requires high-performance printed circuit boards (Printed Circuit Board, PCB), which leads to the refinement of PCB routing and hole design. miniaturization, ultra-thinning and high density of the conductive layer. Blind vias are the hubs connecting all layers of circuits, and their miniaturization and design effects will directly affect the high-density and multi-functionalization of printed circuit boards. The trend of using blind holes to realize the conduction function has been paid more and more attention. Therefore, the manufacturing method and effect of blind holes directly...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/42
Inventor 何为黄雨新胡友作陈苑明徐缓罗旭周华王科成
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA