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Sn-Zn lead-free solder containing Pr, Ga and Se

A lead-free solder, sn-zn technology, applied in the field of Sn-Zn lead-free solder of Se, Ga, containing Pr, can solve difficult industrial production, poor wettability, solder cost, solder melting point gap And other issues

Active Publication Date: 2013-01-02
NANJING UNIV OF AERONAUTICS & ASTRONAUTICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the representative lead-free solders include Sn-Ag-Cu, Sn-Cu, Sn-Cu-Ni and other alloy systems, each with its own strengths, but compared with tin-lead solders, the cost of solder, solder There is still a certain gap in terms of melting point, etc.
Sn-Zn solder melting point and raw material cost are lower than Sn-Ag-Cu, Sn-Cu, Sn-Cu-Ni solder, especially Sn-Zn solder melting point is very close to tin-lead solder, but due to Sn -Zn series solder has poor wettability, so it is still difficult to apply to industrial production, and still needs research and improvement
[0003] In recent years, "Sn-Zn-Ga-Ce lead-free solder" (Chinese invention patent, CN101269446) and "a tin-zinc-based lead-free solder alloy" (Chinese invention patent) have been developed on the basis of Sn-Zn at home and abroad in recent years. , CN101585120), "A Sn-Zn lead-free solder alloy and its preparation method" (Chinese invention patent, CN101058131) and "Sn-Zn-based lead-free solder alloy containing rare earth elements" (Chinese invention patent, CN1390672) Sn-Zn solders of various "multi-alloy systems" have improved some properties compared with binary Sn-Zn alloys, but they are still not as good as traditional Sn-Pb solders in terms of overall performance, so , Sn-Zn solder still needs further improvement

Method used

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  • Sn-Zn lead-free solder containing Pr, Ga and Se

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] A kind of Sn-Zn lead-free solder containing Pr, Ga, Se, proportioned by mass percentage, its composition is: 6.0% of Zn, 0.5% of Pr, 0.005% of Ga, 0.001% of Se, remaining The amount is Sn.

[0022] The solidus temperature of the "Sn-Zn lead-free solder containing Pr, Ga, Se" obtained from the above composition ratio is about 198°C, and the liquidus temperature is about 206°C (both taking into account experimental errors). Cooperating with commercially available RMA flux has excellent wettability on the copper plate, and the tensile strength of the brazing seam reaches 75MPa±15MPa.

Embodiment 2

[0024] A kind of Sn-Zn lead-free solder containing Pr, Ga, Se, proportioning by mass percentage, its composition is: 10.5% Zn, 0.005% Pr, 1.5% Ga, 0.3% Se, the balance is Sn.

[0025] The solidus temperature of the "Sn-Zn lead-free solder containing Pr, Ga, Se" obtained by the above-mentioned composition ratio is about 198°C, and the liquidus temperature is about 207°C (all considering experimental errors). Cooperating with commercially available RMA flux has excellent wettability on the copper plate, and the tensile strength of the brazing seam reaches 75MPa±15MPa.

Embodiment 3

[0027] A kind of Sn-Zn lead-free solder containing Pr, Ga, Se, proportioning by mass percentage, its composition is: the Zn of 8.5%, the Pr of 0.25%, the Ga of 1.0%, the Se of 0.2%, the surplus is Sn.

[0028] The solidus temperature of the "Sn-Zn lead-free solder containing Pr, Ga, Se" obtained by the above composition ratio is about 198°C, and the liquidus temperature is about 204°C (both taking into account the experimental error). Cooperating with commercially available RMA flux has excellent wettability on the copper plate, and the tensile strength of the brazing seam reaches 75MPa±15MPa.

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Abstract

The invention discloses a Sn-Zn lead-free solder containing Pr, Ga and Se, and belongs to metal material types and solder materials in the metallurgical field. The Sn-Zn lead-free solder containing Pr, Ga and Se comprises the following chemical components in percentage by weight: 6.0-10.5% of Zn, 0.005-0.5% of Pr, 0.005-1.5% of Ga, 0.001-0.3% of Se and the balance of Sn. Because the solder has excellent 'oxidation resistant property', the Sn-Zn lead-free solder containing Nd, Ga and Se has favorable wetting performance and excellent welding spot (soldering seam) performance, and is suitable for welding methods of wave peak welding, immersion welding, manual welding, reflow soldering and the like of the electronic industry.

Description

Technical field [0001] The present invention involves a lead-free material containing PR, GA, and SE, which belongs to the welding material in the field of metal materials and metallurgy.It is mainly used for the assembly and packaging of components in the electronics industry. It is a new green and environmentally friendly leading puppet material with good welding performance (such as wetting performance) with excellent mechanical properties. Background technique [0002] With the effectiveness of the ROHS (The RESTRiction of the Use of Certain Hazardous Substance in Electrical and Electronic Equipment) instructions, the alternative problem of tin -leading materials has always been a hot spot in the research of electronic industry technicians.At present, the representative lead-free rafters include SN-AG-CU, SN-CU, SN-CU-NI and other alloy departments. They have their own strengths. HoweverThere is still a certain gap in the melting point.SN-Zn system molten melting point and ra...

Claims

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Application Information

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IPC IPC(8): B23K35/26
Inventor 叶焕薛鹏薛松柏龙伟民于新泉
Owner NANJING UNIV OF AERONAUTICS & ASTRONAUTICS
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