Epoxy resin pouring sealant and usage method
A technology of epoxy resin and potting glue, which is applied in epoxy resin potting glue, epoxy resin potting glue with high bending and compressive strength, and low thermal expansion coefficient. Compressive strength and other issues, to achieve the effect of good high temperature electrical properties, long service life, and small internal friction
Active Publication Date: 2013-01-02
CENT SOUTH UNIV
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- Description
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Problems solved by technology
Epoxy resin potting materials satisfying low thermal expansion coefficient, ...
Method used
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Embodiment 1
[0015] Prepared epoxy resin potting glue, the content of each component is
[0016]
Embodiment 2
[0017] Embodiment 2: the epoxy resin encapsulant material of low thermal expansion coefficient, high bending resistance and compressive strength that the present invention relates to, the content of each component is
[0018]
Embodiment 3
[0020] Prepared epoxy resin potting glue, the content of each component is
[0021]
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The invention relates to an epoxy resin pouring sealant and a usage method. The epoxy resin pouring sealant is composed of an o-cresol-formaldehude epoxy resin matrix, a methylhexahydrophthalic anhydride curing agent, an electronic grade torispherical silica micro powder filler, a diluent and an antifoaming agent, wherein the composition ratio of the epoxy resin matrix to the curing agent is 1: (0.6-1.4), and the composition ratio of the epoxy resin matrix to the filler is 1: (0.3-2.4). According to the epoxy resin pouring sealant, a curing process is that pre-curing is performed at the temperature of 90 DEG C for 0.5-1 hour, and curing is performed at the temperature of 150 DEG C for 2-3 hours. The epoxy resin pouring sealant has the advantages of being low in toxicity, density, thermal expansivity coefficient and water absorption rate, high in bending strength and compressive strength and good in application prospect and can be widely applied to electronic controllers, sensors, aerospace components and the like.
Description
technical field [0001] The invention relates to an epoxy resin potting glue and a usage method thereof, in particular to an epoxy resin potting glue with a low coefficient of thermal expansion and high bending and compressive strength and a usage method thereof. The invention belongs to the technical field of adhesive preparation. Background technique [0002] Potting glue, also known as electronic glue, is a broad term. Used for bonding, sealing, potting and coating protection of electronic components. The potting glue is liquid before it is cured and has fluidity. The viscosity of the glue varies according to the material, performance and production process of the product. Only when the potting glue is completely cured can its use value be realized. After curing, it can play the role of waterproof, moisture-proof, dust-proof, insulation, heat conduction, confidentiality, corrosion resistance, temperature resistance, and shock resistance. With the expansion of the applic...
Claims
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Login to view more IPC IPC(8): C09J163/04C09J11/06C09J11/04C09K3/10
Inventor 卢安贤罗志伟刘学峰陈兴军瞿高
Owner CENT SOUTH UNIV
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