Wire with active solder coating and method of use thereof
An active solder and coating technology, applied in semiconductor devices, climate sustainability, photovoltaic power generation, etc., can solve problems such as affecting the overall production volume of cells, time-consuming and complex steps, and unfavorable solderability.
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[0026] In order to make the above and other objects, features and advantages of the present invention more comprehensible, preferred embodiments of the present invention will be exemplified below in detail together with the attached drawings. Furthermore, the directional terms mentioned in the present invention, such as "up", "down", "front", "rear", "left", "right", "inside", "outside" or "side", etc., It is only for orientation with reference to the attached drawings. Therefore, the directional terms used are used to illustrate and understand the present invention, but not to limit the present invention.
[0027] Please refer to the attached Figure 2A To attach Figure 2D As shown, it discloses a schematic flow chart of a method for using a wire with an active solder coating according to a preferred embodiment of the present invention, wherein the method mainly includes the following steps: providing a substrate 2; providing a wire 3 having a wire 31 and An active solder...
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