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Curable resin composition, adhesive epoxy resin paste, die-bonding agent, non-conductive paste, adhesive epoxy resin film, non-conductive epoxy resin film, anisotropic conductive paste, and anisotropic conductive film

A technology of curable resin and epoxy resin, applied in the direction of conductive materials dispersed in non-conductive inorganic materials, epoxy resin glue, adhesive type, etc., can solve the cracking of conduction resistance adhesive and poor thermal expansion rate , high elastic modulus, etc., to achieve high conduction reliability and maintain the effect of crack resistance

Active Publication Date: 2013-01-02
DEXERIALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, anisotropic conductive adhesives using conventional adhesives that use epoxy resins as matrix resins have high elastic modulus and are difficult to relax stress. ), high temperature and high humidity test, pressure cooker (PCT test and other reliability tests, based on the difference in thermal expansion coefficient with the connecting substrate, there will be an increase in conduction resistance due to internal stress, peeling of the joint surface, adhesive (adhesive agent) cracking problem

Method used

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  • Curable resin composition, adhesive epoxy resin paste, die-bonding agent, non-conductive paste, adhesive epoxy resin film, non-conductive epoxy resin film, anisotropic conductive paste, and anisotropic conductive film
  • Curable resin composition, adhesive epoxy resin paste, die-bonding agent, non-conductive paste, adhesive epoxy resin film, non-conductive epoxy resin film, anisotropic conductive paste, and anisotropic conductive film
  • Curable resin composition, adhesive epoxy resin paste, die-bonding agent, non-conductive paste, adhesive epoxy resin film, non-conductive epoxy resin film, anisotropic conductive paste, and anisotropic conductive film

Examples

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preparation example Construction

[0042] 1-6. Preparation method of curable resin composition

[0043] 2. Other embodiment using curable resin composition

[0044] 3. Examples.

[0045]

[0046] The curable resin composition of the present embodiment contains an epoxy resin and a curing agent for an epoxy resin, and the difference between the maximum value of tan δ in the viscoelastic spectrum and the value of tan δ at −40° C. is 0.1 or more.

[0047] The tan δ (loss tangent value) refers to a value of 0 or more and less than 1 calculated by the formula represented by tan δ=E'' / E'. Among them, E'' is the loss elastic modulus, and E' is the storage elastic modulus. Tanδ is calculated as follows, for example, by measuring the viscoelastic spectrum of the storage elastic modulus (E') and the viscoelastic spectrum of the loss elastic modulus (E'') within a predetermined temperature range with a viscoelasticity testing machine, From this, tan δ was calculated from the above formula. The larger the value of ta...

Embodiment

[0094] Specific examples of the present invention will be described below. Moreover, any one of the following examples does not limit the scope of the present invention.

[0095]

[0096] ·Acrylic

[0097] Ethyl Acrylate (EA100), Glycidyl Methacrylate (GMA10)

[0098] ·Epoxy resin

[0099] 1,3,5-Triglycidyl isocyanurate (manufactured by TEPIC Nissan Chemical Industry Co., Ltd.), alicyclic epoxy resin (manufactured by CEL Hitachi Chemical Co., Ltd.), glycidyl hexahydrobisphenol A (manufactured by YX8000 JER Co., Ltd. ), dicyclopentadiene type liquid epoxy resin (EP4088SS)

[0100] ·Hardener

[0101] Methylhexahydroxyphthalic anhydride (MeHHPA, Nippon Chemical Co., Ltd.), diethylglutaric anhydride (Degan, Kyowa Hakka Chemical Co., Ltd.)

[0102] ·Curing Accelerator

[0103] 2-Ethyl-4-methylimidazole (2E4MZ manufactured by Shikoku Chemical Industry Co., Ltd.)

[0104] ·Conductive particles

[0105] Particles made by plating Ni / Au on 5 μm cross-linked polystyrene resin p...

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Abstract

Disclosed is a curable resin composition which exhibits high adhesion, high conduction reliability, excellent crack resistance and increased resistance to thermal shock or similar in high-temperature high-humidity environments. The curable resin composition contains an epoxy resin, and a curing agent for epoxy resin, and is characterised in that the difference between the maximum tan[delta] value in the viscoelastic spectrum and the tan[delta] value at -40 DEG C is at least 0.1.

Description

technical field [0001] The present invention relates to a curable resin composition, an adhesive epoxy resin paste, and a chip having improved resistance to thermal shock and the like under high-temperature and high-humidity environments, high adhesiveness, high conduction reliability, and good crack resistance Adhesives, non-conductive pastes, adhesive epoxy resin films, non-conductive epoxy resin films, anisotropic conductive pastes, and anisotropic conductive films. [0002] This application claims priority based on Japanese Patent Application No. Japanese Patent Application No. 2010-92671 for which it applied in Japan on April 13, 2010, By referring these applications, they are used in this application. Background technique [0003] As a method of mounting chips of driver ICs, LED elements, and the like to a substrate, a wire bonding method is used. In the wire bonding method, as shown in FIG. 7 , the electrical connection between the element 33 and the substrate 31 is ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/18C08G59/42C09J7/00C09J9/02C09J11/06C09J163/00C09J201/00H01B1/22H01B5/16
CPCC08G59/42C08L63/00C09J9/02C09J163/00C08L33/068H01L2224/48091H01L2224/49107H01L2224/73204H01L2224/73265H01L2224/14C08F220/1802H01L2924/00014C08F220/325C08F220/18C08F222/04C09J7/30
Inventor 波木秀次石神明马越英明蟹泽士行
Owner DEXERIALS CORP