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Novel transparent conductive film and preparation method thereof

A transparent conductive and adhesive film technology, applied in the direction of adhesives, epoxy resin adhesives, adhesive types, etc., can solve the problems of small thickness of the conductive layer, low volume resistivity, low adhesion, etc., to achieve stable conductive network, Low volume resistivity and good toughness

Active Publication Date: 2013-01-09
常州凯得新材料科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The above transparent conductive film is mainly characterized by conductive film surface, small thickness of conductive layer, low ductility and low adhesion.
[0005] Existing conductive adhesive films rarely use epoxy resin matrix, because it is difficult to achieve a very soft level, most of them are PET matrix, and the preparation method is to heat the conductive filler to soften the matrix by hot pressing Pressed into the matrix resin, the surface resistivity of the obtained conductive adhesive film meets the requirements, but the volume resistivity is very low

Method used

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  • Novel transparent conductive film and preparation method thereof
  • Novel transparent conductive film and preparation method thereof
  • Novel transparent conductive film and preparation method thereof

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Experimental program
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Effect test

Embodiment

[0031] Weigh epoxy resin, diluent, anti-UV additive, curing agent, curing accelerator according to the mass percentage of each substance in the 6 groups of experiments given in Table 2, and mix them. The way of mixing is mechanical stirring, the stirring rate is 1000 rpm, and the time is 10 minutes. Then, the weighed mixed filler of silver nanowires and silver nanoparticles is sequentially added into the mixture under stirring state. Continue to stir for 15 minutes after the addition, vacuum defoaming treatment to obtain a uniformly mixed jelly, which is the transparent conductive film solution. The ethanol in the mixed solution was volatilized at room temperature, and then the glue solution was coated on a tetrafluoroethylene mold, and cured at room temperature for 24 hours. After the curing is completed, the transparent conductive adhesive film is obtained by demolding, the thickness of which is controlled at 5mm, and the performance test is carried out.

[0032] Light tra...

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Abstract

The invention aims to solve the technical problems of overcoming the defects of high resistivity, low ductility and poor adhesion between a conductive layer and a basal body of the transparent conductive film in the prior art and provide a novel transparent conductive film and a preparation method thereof. The novel transparent conductive film comprises the following components in percentage by mass: 25-35 percent of hydrogenated bisphenol A epoxy resin, 22-25 percent of epoxy resin active diluting agent, 0.5-1.5 percent of anti-ultraviolet (UV) additive, 20-30 percent of hydrogenated alicyclic amine, 2.5-4 percent of modified amine type curing promoter and 12-27 percent of conductive filler. The transparent conductive film is low in both surface resistivity and size resistivity, can be made into thin films of different thickness, and has the advantages of high transparency, high conductivity, high adhesion strength and the like; and the preparation method has the advantages of simple preparation method, readily available raw materials and non-severe preparation conditions.

Description

technical field [0001] The invention relates to a method for preparing a thin film with transparent, conductive and bonding functions. Background technique [0002] The transparent conductive adhesive film has good conductivity, high transparency in the visible light wave band, and a film with adhesive function. It is widely used in flat panel displays, thin film solar cells, sensors, touch screens, and stretchable electronics. [0003] The traditional transparent conductive film material is mainly tin-doped indium oxide (ITO). The thickness of the film is generally in the order of tens of nanometers to microns, and it is mainly attached to hard substrates such as glass. Due to the lack and high cost of indium resources, people have developed transparent conductive films based on conductive polymers, conductive nanowires, carbon nanotubes and graphene, and expanded to polyethylene terephthalic acid (PET), polyvinyl alcohol, polyethylene and other flexible substrates, and de...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/00C09J163/00C09J11/04C09J11/06
Inventor 陶宇王标兵王留阳陶瑜骁吴海平
Owner 常州凯得新材料科技有限公司
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