Crack-free multilayer high-barrier packaging film prepared by adopting rotary radio frequency magnetron sputtering method

A radio frequency magnetron sputtering and packaging film technology, which is applied in sputtering coating, coating, metal material coating process, etc., can solve the problems of poor barrier performance and durability of silicon oxide film, and achieve good barrier properties and Effects of durability, increased flexibility, and reduced brittleness

Inactive Publication Date: 2013-01-16
HARBIN UNIV OF COMMERCE
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  • Description
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  • Application Information

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Problems solved by technology

[0006] The purpose of the present invention is to solve the problem of poor barrier performance and durability due to brittle cracks in the existing silicon oxide film prepared by traditional physical vapor deposition (PVD) method, and provide a non-woven fabric prepared by rotary radio frequency magnetron sputtering method. Cracked Multilayer High Barrier Packaging Film

Method used

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  • Crack-free multilayer high-barrier packaging film prepared by adopting rotary radio frequency magnetron sputtering method
  • Crack-free multilayer high-barrier packaging film prepared by adopting rotary radio frequency magnetron sputtering method

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Effect test

specific Embodiment approach 1

[0018] Specific implementation mode 1: In this implementation mode, the preparation of non-crack multi-layer high barrier packaging film by the rotary radio frequency magnetron sputtering method is carried out according to the following steps:

[0019] 1. Use anhydrous alcohol to ultrasonically clean the plastic substrate with a thickness of 12 to 200 microns for 10 to 20 minutes, then dry it, and then corona treat the substrate for 2 to 6 minutes before placing it in a vacuum chamber;

[0020] 2. Wrap the substrate on the substrate roller and fix it. Start the mechanical pump until the thermocouple gauge shows 380-420Pa. Start the Roots pump until the thermocouple gauge shows 6.5-6.8Pa. Start the molecular pump. Bottom vacuum to 3×10 -4 Pa~5×10 -4 Pa;

[0021] 3. Unscrew the mass flow meter to control the Ar gas flow to 30-120sccm, adjust the working air pressure to 0.2-0.8Pa, then turn on the rotating motor to make the drum drive the substrate to rotate, and the drum rotat...

specific Embodiment approach 2

[0028] Specific embodiment 2: The difference between this embodiment and specific embodiment 1 is that the plastic substrate in step 1 is polyethylene (PE), polypropylene (PP), polyethylene terephthalate (PET) or polyethylene Ethylene naphthalate (PEN). Other steps and parameters are the same as those in Embodiment 1.

specific Embodiment approach 3

[0029] Specific embodiment three: the difference between this embodiment and specific embodiment one or two is that step four will SiO 2 The RF power density of the ceramic target is adjusted to 1.35~2.86W / cm 2 , Adjust the RF power density of the cured epoxy resin target to 1.12-2.95W / cm 2 . Other steps and parameters are the same as those in Embodiment 1 or Embodiment 2.

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Abstract

The invention discloses a crack-free multilayer high-barrier packaging film prepared by adopting a rotary radio frequency magnetron sputtering method, relating to a preparation method of a composite packaging film and solving the problem of poor barrier property and durability caused by brittle cracks on the traditional silicon oxide film. A preparation method of the crack-free multilayer high-barrier packaging film comprises the steps of: 1, placing a plastic substrate subjected to ultrasonic cleaning and corona treatment in a vacuum chamber; 2, winding the substrate on a roller for fixing, regulating a vacuum system; 3, introducing Ar gas, regulating a working pressure, driving the substrate to rotate by the roller; 4, starting a radio frequency power supply, firstly pre-sputtering a SiO2 porcelain target and an epoxy resin target, then opening a baffle plate, alternatively depositing an epoxy resin film layer and a SiO2 porcelain film layer, and preparing the crack-free multilayer high-barrier packaging film. The crack-free multilayer high-barrier packaging film prepared by adopting the preparation method is repeatedly folded for 100 times, and is degraded in transmission property to below 10 percent so that excellent durability and barrier property are shown. The crack-free multilayer high-barrier packaging film is mainly applied to package of foods, precision machinery parts, electronic components and medical instruments.

Description

technical field [0001] The invention relates to a preparation method of a composite packaging film. Background technique [0002] The loss of agricultural products and food due to the lack of high barrier packaging materials in the world accounts for about 20% of the total output. In my country, 20% of the total output of fruits and vegetables is lost during transportation and storage due to insufficient barrier properties of packaging materials amounting to 70 billion US dollars. On the other hand, high-barrier packaging materials can also be applied to the packaging of precision mechanical parts, electronic parts, drugs and medical instruments. Therefore, the research on high barrier packaging materials is of great significance. [0003] At present, technologies such as multi-component compounding, multi-layer compounding, blending, vacuum evaporation, and plasma technology evaporation are generally used to improve the barrier properties of materials. Multi-component, m...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/40C23C14/06
Inventor 刘壮孙智慧朱琳林晶常江杨春莉
Owner HARBIN UNIV OF COMMERCE
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