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Flux composition, process for producing electrically connected structures, electrically connected structure, and semiconductor device

A technology of electrical connection and composition, which is applied in the direction of semiconductor devices, semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, etc., and can solve problems such as uneven solder flux composition and inability to form a good electrical connection structure , to achieve the effect of a good connection structure

Inactive Publication Date: 2013-02-13
JSR CORPORATIOON
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] In particular, in the case of a stud bump including two different metal types as described in Japanese Patent Application Laid-Open No. 2006-332694, wettability differs depending on the metal type, so there is a concern that the conductive member is exposed during reflow soldering. , In addition, the flux composition tends to become uneven, and it is impossible to form a good electrical connection structure

Method used

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  • Flux composition, process for producing electrically connected structures, electrically connected structure, and semiconductor device
  • Flux composition, process for producing electrically connected structures, electrically connected structure, and semiconductor device
  • Flux composition, process for producing electrically connected structures, electrically connected structure, and semiconductor device

Examples

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Embodiment

[0091]Hereinafter, examples are given and the present invention will be specifically described. The present invention is not limited by these examples in any way. The "part" in the example is the quality standard.

[0092] [1] Preparation of flux composition

example 1～ example 20 and comparative example 1

[0094] The flux compositions of Examples 1 to 20 and Comparative Example 1 were produced by mixing the components shown in Table 1 below at the ratios shown in Table 1. The numerical values ​​shown in Table 1 represent parts by mass. The details of each component are as follows. "Mw" is the polystyrene-equivalent weight average molecular weight measured by the gel permeation chromatography. The viscosity is a value measured at 23° C. with a B-type viscometer.

[0095] A-1: Glycerin

[0096] B-1: Polyvinylpyrrolidone (Mw: 6000-15000, degree of polymerization: 60-930)

[0097] B-2: Polyvinyl alcohol (saponification degree: 87mol%-89mol%, polymerization degree: 300-500)

[0098] C-1: polyethylene glycol (viscosity: 0.003Pa·s~0.02Pa·s)

[0099] C-2: Tetraethylene glycol

[0100] C-3: Polyoxypropylene polyglyceryl ether (0.3Pa·s~0.5Pa·s)

[0101] C-4: diglyceryl caprylate (viscosity: 0.3Pa·s~0.5Pa·s)

[0102] C-5: Polyoxyethylene polyglyceryl ether (viscosity: 0.3Pa·s~0.5Pa...

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Abstract

A flux composition includes an alditol (A) and a polymer (B) which has a repeating structural unit represented by Formula (1): (wherein R1 is a hydrogen atom or a methyl group, and Z is a hydroxyl group, an oxo group, a carboxyl group, a formyl group, an amino group, a nitro group, a mercapto group, a sulfo group, an oxazoline group, an imide group, a group having an amide structure, or a group having any of these groups). The flux composition allows substrates with bumps such as pillar bumps to be electrically connected to each other by reflowing of such bumps without causing any exposure of the bumps from the flux during reflowing, thus resulting in a satisfactory electrically connected structure.

Description

technical field [0001] The invention relates to a flux composition, a method for forming an electrical connection structure, an electrical connection structure and a semiconductor device. Background technique [0002] Conventionally, flux compositions have been used for electrical connection of electronic components and the like to component mounting substrates. Fusible conductive members such as solder are heated to 200°C to 300°C during thermal melting (reflow), so if no flux composition is used, conductive members of electronic parts such as solder or copper foil are easily oxidized and formed Oxide film cannot be electrically connected well. By covering the conductive members of electronic parts such as solder or copper foil with a flux composition, not only block oxygen to prevent the oxidation of conductive members of electronic parts such as solder or copper foil, but also reduce the oxides that have been generated, and make the melting The solder wets well, and ele...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/36B23K1/00H05K3/34H01L21/60H01L23/488
CPCH01L2224/13111H01L2224/13139H05K3/3436H01L2224/16145B23K31/02H01L2224/13144H01L2224/81191H01L2224/11849H01L2224/81911H01L23/488H01L2224/81815H01L2224/81011H01L24/16H01L24/11B23K35/3612H01L2224/13155H01L24/13B23K35/3613H01L2224/13147H01L2224/13118H05K3/3489H01L2224/13082H01L2224/13109B23K35/362H01L2224/13113H01L2224/13124H01L2224/16227H01L2224/81024H01L2224/16225H01L24/81H01L2224/8191H01L2924/15788H01L2924/00014H01L2924/01082H01L2924/01083H01L2924/01049H01L2924/01051H01L2924/0103H01L2924/01047H01L2924/00B23K35/36C08K5/053C08L23/02H05K3/34
Inventor 高桥诚一郎山口虎彦后藤宏文
Owner JSR CORPORATIOON
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