Flexible heat-conducting resin, and prepreg and metal base copper clad laminate prepared from same

Abstract

The invention discloses flexible heat-conducting resin which is used as bonding material of metal base copper clad laminate and comprises the following components in percentage by weight: 2%-60% of epoxy resin, 0.1%-50% of elastomer component, 0.05%-10% of a curing agent, 0.0001%-5% of catalyst, 0.00001%-5% of a coupling agent, and 1%-95% of alumina. With the addition of elastomer component, the prepared flexible heat-conducting resin has the advantages of high adhesive ability, heat resistance, thermal conductivity and insulating property, no easy cracking, and improved product quality.

Description

technical field [0001] The invention relates to the technical field of circuit board materials, in particular to a flexible thermally conductive resin. Background technique [0002] Metal-based copper-clad junction boards used for communication module power boards, LED lighting heat dissipation circuit boards and engine electronic igniter boards, frequency converters, wind power generation, photovoltaic power generation inverters, etc., most of the existing technologies are three-layer composite structures. It consists of a metal substrate, a thermally conductive and insulating adhesive layer and a copper junction composite bond. [0003] The thermally conductive and insulating adhesive layer of the above-mentioned existing metal-based copper-clad junction board has high operating current and voltage in the circuit part, especially when used as a communication base station circuit module, the operating frequency is high, and it needs to withstand high operating temperature. ...

AI Technical Summary

Problems solved by technology

[0004] Currently popular metal-based copper clad laminate products, in order to meet the above requirements, its thermally conductive and insulating adhesive layers are all high adhesive force, high rigidity (that is, high flexural modulus, low elongation at break) and low linear thermal expansion coefficient, such thermal conductivity Insulation adhesive resin and the metal substrate surface and heat dissipation insulation adhesive layer resin are firmly bonded, but they are bent and deformed during the metal-based copper clad laminate process, and when subjected to a certain frequency of cold and heat changes, especially high thermal conductivity with high filler filling rate When the coefficient is low, it is easy to cause the metal substrate to separate from the thermally conductive and insulating adhesive layer, and the resin itself is cracked, resulting in mechanical damage, low withstand voltage, and easy to be partially broken down and discharged, which seriously affects its durable performance. Especially when used as LED lighting substrate and high-power inverter circuit substrate, it will cause light failure or even burn out LED light-emitting diodes and power components

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