Insulating composition, insulating material using the same, umbrella cover and insulator, and manufacturing method
A technology for insulating materials and composite insulators, which is applied in the field of preparing high-voltage composite insulators from compositions including hydrophobic alicyclic epoxy compounds, and can solve problems that affect the safe operation of composite insulators and complex operating conditions
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preparation example Construction
[0091] A method for preparing a composite insulator, the method comprising the steps of:
[0092] (1) Insert the mandrel 1 into the central hole of the metal fitting 2, and then press it tightly to obtain the mandrel 1-metal fitting 2 composite.
[0093] Preferably, a conventional commercially available crimping machine can be used to squeeze the mandrel 1 and the fitting 2, so that the mandrel 1-the fitting 2 can be compressed.
[0094] When the high-voltage composite insulator is running on the line, it will be subjected to the long-term action of the electromechanical load, and the mechanical strength of the composite insulator will decrease with time. The main reason for this phenomenon is that the mandrel material itself has creep characteristics. At the same time, if the parameter design is unreasonable during the crimping process, the stress in the crimping area between the fittings and the mandrel will be too concentrated, and the mechanical strength of the insulator w...
Embodiment 1
[0125] Prepare the following components: A component, 70kg hexahydrophthalate bisglycidyl ether, and 30kg carboxyl-terminated nitrile rubber toughened bisphenol A diglycidyl ether (the weight of nitrile rubber and bisphenol A diglycidyl ether The ratio is 100:12-18);
[0126] B component, 97.5kg methyl hexahydrophthalic anhydride, and 2.5kg of DMP-30 (2,4,6-tris(dimethylaminomethyl)phenol);
[0127] C component, 310kg silica. Among them, the silicon dioxide consists of 5wt% particles of 38 microns < particle size ≤ 48 microns (300 mesh), 80 wt% of particles of 23 microns < particle size ≤ 38 microns (400 mesh), 10 wt% of 13 microns < particle size ≤ It is prepared by mixing 23 micron (600 mesh) particles and 5wt% particles with a particle size of ≤13 micron (1000 mesh).
[0128] Use AH-type stirring and vacuum mixing device to mix A component, B component and C component and vacuumize until the mixed glue is obtained. The above mixed rubber was injected into the mold by aut...
Embodiment 2-10
[0130] The methods used in Examples 2-10 are basically the same as those in Example 1, the differences are shown in Table 4.
[0131] Table 4
[0132]
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