Epoxy phenolic resin adhesive and epoxy phenolic adhesive tape and laminated board manufactured by adhesive

Abstract

Disclosed are an epoxy phenolic resin adhesive and an epoxy phenolic adhesive tape and a laminated board manufactured by the adhesive. The epoxy phenolic resin adhesive comprises solid components, liquid components and organic solvent components, the solid and liquid components comprise, by weight, 60% to 70% of E epoxy, 30% to 40% of phenolic resins, 3% to 6% of fillers, 0.5% to 0.8% of curing agents and 0.1% to 0.2% of accelerants, and the solid and liquid components account for 50% to 70% of the total weight. The prepared epoxy phenolic adhesive tape comprises a glass fiber cloth and the adhesive coated on the glass fiber cloth, the thickness of the glass fiber cloth is in a range from 100mum to 140mum, the thickness of the adhesive is in a range from 150mum to 200mum, and the adhesive is the epoxy phenolic resin adhesive. The adhesive has the advantages of low viscosity, good manufacturability, heat stability, weather resistance and chemical medicine resistance, long storage period, high heat resistance and extremely low toxicity. The epoxy phenolic adhesive tape prepared by the adhesive can still be normally used after being stored at the temperature of 40 DEG C for a half month. The epoxy phenolic laminated board prepared by the adhesive tape has the advantages of simple preparation technology and excellent relevant mechanical performance index.

Description

technical field [0001] The invention relates to an epoxy phenolic resin adhesive and an epoxy phenolic tape and a laminate made of the adhesive. technical background [0002] At present, with the rapid development of electrical and electronic fields and their composite materials, the demand for copper clad laminates is increasing, and the performance requirements for cured epoxy resins are also getting higher and higher. However, dicyandiamide, the mainstream curing agent in the manufacture of epoxy resin laminates, is incompatible with epoxy resins, which easily leads to uneven curing reactions and poor heat and water resistance of cured products. Under the circumstances that the heat resistance and moisture resistance of copper clad laminates for electronic devices are getting higher and higher, this traditional curing agent can no longer meet the needs of the rapid development of the electronics industry. The molecular structure of the phenolic resin produced by the re...

AI Technical Summary

Problems solved by technology

[0005] (2) The storage period of the tape is short

After two days of storage at 40°C, the solubility dropped to 68.09%, and qualified products could not be pressed

Due to the short storage period of the tape, the laminates produced in summer are prone to surface pitting and delamination, resulting in a significant decrease in heat resistance and insulation resistance after immersion in water, resulting in a large number of waste products, so production is forced to stop in the hot summer season

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