Laser profile modification method for reducing modal coupling error of vibratory silicon micro-machined gyroscope

A silicon micro-gyroscope and modal coupling technology, which is applied in laser welding equipment, instruments, measuring devices, etc., can solve the problems that restrict the performance of micro-gyroscopes, and achieve the effect of low processing conditions, simple operation, and simple principle
CN102980591AActive Publication Date: 2013-03-20NAT UNIV OF DEFENSE TECH
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
NAT UNIV OF DEFENSE TECH
Publication Date
2013-03-20

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Abstract

The invention discloses a laser profile modification method for reducing the modal coupling error of a vibratory silicon micro-machined gyroscope. The method comprises the following steps: 1, signal test: testing the driving signal Vd and the modal coupling error signal Vm of a silicon micro-machined gyroscope chip, and determining the peak values and the phase relationships of the two signals; 2, determining the laser profile modification type according to the signals in step 1; 3, determining the profile modification position according to the signals in the step 1; and 4, carrying out laser profile modification according to the type obtained in step 2 and the position obtained in step 3. The laser profile modification method has the advantages of simple principle, simple operation, reduction of the modal coupling error, and improvement of the working performances of the silicon micro-machined gyroscope.
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Description

technical field

[0001] The invention mainly relates to the field of processing technology in micro-electro-mechanical systems, in particular to a laser shape modification method for manufacturing silicon micro-mechanical gyroscopes that can reduce modal coupling errors caused by processing errors of silicon micro-gyroscope vibration structures. Background technique

[0002] Vibrating silicon micromachined gyroscopes have the advantages of small size, light weight, low cost, high reliability, and easy integration with circuits. They have been widely used in communication equipment, automotive safety and navigation, robotics, aerospace, and game consoles. Vibrating silicon micromechanical gyroscopes are usually made of thin-sheet single-crystal silicon, and are manufactured by semiconductor processing techniques such as wet etching and dry etching, and their structural size can be as small as submicron.

[0003] Since the production of the vibrating silicon micromachined gyros...

Claims

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