Novel positive-temperature-coefficient thermistor element core layer material and application thereof
A technology of thermistor element and positive temperature coefficient, applied in the direction of resistors with positive temperature coefficient, etc., can solve the problems of large space occupied by the circuit board, reduced PTC strength, poor electrical performance and PTC strength, etc., to increase the interface Compatibility, the effect of reducing room temperature resistivity and improving processability
Active Publication Date: 2013-04-03
SHANGHAI KETER POLYMER MATERIAL
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Problems solved by technology
[0003] To obtain low resistance is mainly by increasing the area of the component or increasing the content of conductive filler in the conductive composite material, but the area of the component is increased, occupying a large space on the circuit board, and the thermal performance is not ideal
The addition of conductive fillers will affect the processability of conductive composites, reduce the strength of PTC, that is, reduce the range where the resistivity of conductive composites increases in response to temperature rise
[0004] The introduction of a compatibilizer maleic anhydride grafted polyethylene
Method used
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Embodiment 1
[0053] 1. Experimental raw materials and ratio
[0054] The types, trade names and sources of raw materials are shown in Table 1; the composition and ratio of raw materials are shown in Table 2.
[0055] The raw material source of table 1 comparative example and embodiment
[0056]
[0057]
[0058] Table 2 Sample formula table (the following substances are weight percentages)
[0059]
[0060] 2. Experimental method
[0061] According to the raw material composition and the proportioning ratio given in Table 2, the core material of positive temperature coefficient thermistor element is prepared, and the specific steps are as follows:
[0062] 1) Grinding the granular polymer, and premixing the powdered polymer with conductive carbon black according to the formula in Table 2;
[0063] 2) Melt and mix the pre-mixed raw materials through the twin-screw, the temperature of each zone of the twin-screw is 180~210°C, the speed of the twin-screw is 80-200 rpm, and then ex...
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Abstract
The invention relates to the field of thermistors, and particularly relates to a positive-temperature-coefficient thermistor element core material and a preparation method thereof. The positive-temperature-coefficient thermistor element core material disclosed by the invention is prepared from the following raw material constituents: 41-54wt% of a polymer base material and 46-59 wt% of a conductive filler; the polymer base material is formed by mixing a graft polymer with a high melt flow rate with a graft polymer with a low melt flow rate; and the graft polymer is selected from one or the combination of more than two of graft polyolefin, graft polyolefin copolymer and graft polyolefin derivative, and the graft group of the graft polymer is a polar group. According to the invention, by using two types of maleic anhydride-grafted high-density polypropylene with different melt flow rates together, processing performance can be improved, room-temperature resistivity can be reduced and production efficiency can be increased; and the two types of maleic anhydride-grafted high-density polypropylene is prepared into an annular positive-temperature-coefficient thermistor element which is good in electrical performance, high in PTC (positive-temperature-coefficient) strength and the like.
Description
technical field [0001] The invention relates to the field of thermistors, in particular to a core layer material of a positive temperature coefficient thermistor element and an application thereof. Background technique [0002] Positive temperature coefficient (positive temperature coefficient, PTC) material means that its resistivity will increase with the increase of temperature. Conductive polymer materials exhibiting PTC behavior can be used in circuit protection components, and such conductive polymer materials generally include polymer components and conductive fillers dispersed therein. Compositions with low resistivity are suitable for circuit protection elements that respond to changes in room temperature or current conditions. Under normal conditions, circuit protection elements in series with a load in a circuit remain at a low temperature and low resistance. But when exposed to overcurrent or overheating conditions, the resistance of the element increases, effec...
Claims
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Patent Timeline
Login to view more IPC IPC(8): C08L51/06C08L51/00C08K3/04H01C7/02
Inventor 李庆北史宇正侯李明吴亮
Owner SHANGHAI KETER POLYMER MATERIAL
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