Fabrication process of highly conductive polymer foam with controlled compression set for EMI shielding applications
A polymer, polymer coating technology, applied in the fields of magnetic/electric field shielding, electrical components, chemical instruments and methods, etc., can solve problems such as loss, inoperability, electronic device failure, etc.
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[0018] According to various aspects, the inventors of the present invention have disclosed example embodiments of electromagnetic interference (EMI) shielding apparatus including, for example, EMI shielding gaskets, input / output gaskets, form gaskets, Conductive foam, fabric foam pads, other shielding devices, etc. EMI shielding devices can be widely used in application equipment, devices and electronic equipment, such as computer servers, desktop computers, digital cameras, internal and external hard disk drives, liquid crystal displays, medical equipment, notebook computers, plasma display panels, printers, set-top boxes, communication Shell chassis, other electronic equipment, other related equipment, etc. EMI shielding devices may be used in electronic equipment, for example, to help suppress leakage of EMI emissions through joints, breaches, openings, etc. in structural components of the electronic equipment (eg, doors, walls, etc.).
[0019] In some example embodiments,...
example 1
[0047] In a first example, conductive polyurethane foam can be formed by the following steps:
[0048] A, at 25°C, utilize 2% aqueous surfactant solution to clean the polyurethane foam;
[0049] B. At 25°C, use 5vol% (volume percentage) hydrochloric acid for 2 minutes of surface treatment;
[0050] C. At 25°C, use 20g / l (grams / liter) of tin dichloride (SnCl 2 ) solution and 35vol% HCL solution for 45 minutes of sensitization;
[0051] D. At 25°C, use 20g / l silver nitrate (AgNO 3 ) solution and 25vol% ammonia water for 45 minutes of activation;
[0052] E. At 30°C, using 15g / l of copper sulfide, 39ml of formaldehyde (37 to 41 weight / volume percent (w / v%)), 37g / l of potassium sodium tartrate (sodiumpotassiumtartrate) and 11g / l of hydrogen Sodium oxide (NaOH) (pH ~ 12 to 13), electroless plating of copper for 30 minutes;
[0053] F. At 80°C to 85°C, use 4g / l nickel chloride, 50ml (ml) of ammonia water (25vol%)), 2g / l of ammonium sulfate, 10g / l of sodium hypophosphite, and 60...
example 2
[0057] In a second example, conductive foam can be formed by the following steps:
[0058] A, at 25°C, utilize 2% aqueous surfactant solution to clean the polyurethane foam;
[0059] B. At 25°C, use 5vol% hydrochloric acid for 2 minutes of surface treatment;
[0060] C. At 25°C, use 20g / l tin dichloride (SnCl 2 ) solution and 35vol% HCL solution for 45 minutes of sensitization;
[0061] D. At 25°C, use 20g / l silver nitrate (AgNO 3 ) solution and 25vol% ammonia water for 45 minutes of activation;
[0062] E. At 30°C, use 18g / l copper sulfide, 50ml formaldehyde (37 to 41w / v%), 45g / l potassium sodium tartrate and 13g / l sodium hydroxide (NaOH) (pH ~ 12 to 13), carrying out electroless plating of copper for 30 minutes;
[0063] F. At 80°C to 85°C, use 4g / l nickel chloride, 50ml (ml) of ammonia water (25vol%)), 2g / l of ammonium sulfate, 10g / l of sodium hypophosphite, and 60ml of Electroless plating of nickel with hydrazine for 30 minutes; and
[0064] G. At 30°C, use 5vol% to...
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