Preparation method for silicon nitride matrix
A technology of silicon nitride substrate and silicon source, which is applied in the field of preparation of silicon nitride substrate, can solve the problems of low performance of ceramic substrate, and achieve the effects of excellent mechanical properties, good deposition uniformity, and stable wave transmission performance
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Embodiment 1
[0027] (1) Select the 2-dimensional plain weave carbon cloth with the brand name T300, and cut the carbon cloth into a small sample with a plane size of 50mm×50mm as the base material;
[0028] (2) Hang the above base material on the supporting sample holder of the vacuum furnace, and the sample is in the center of the isothermal zone in the furnace;
[0029] (3) Prepare Si with uniform thickness on the substrate by CVD / CVI method 3 N 4 , the precursor is MTS-NH 3 -H 2 -Ar,H 2 Carrier gas and NH 3 The flow ratio is 5:3, H 2 The dilution ratio of the total amount and MTS is 10.2:1, the reaction temperature is 900°C, the holding time is 7 hours, and the pressure in the furnace is 400Pa.
Embodiment 2
[0031] (1) Select porous Si 3 N 4 The ceramic substrate is pre-processed according to the size of 22.86mm × 10.16mm × 2.2mm, and the surface of the formed substrate is ground and polished as the base material;
[0032] (2) Hang the above base material on the supporting sample holder of the vacuum furnace, and the sample is in the center of the isothermal zone in the furnace;
[0033] (3) Prepare Si with uniform thickness on the substrate by CVD / CVI method 3 N 4 , the precursor is MTS-NH 3 -H 2 -Ar,H 2 Carrier gas and NH 3 The flow ratio is 5:3, H 2 The total amount and the MTS dilution ratio are 8:1, the reaction temperature is 1200°C, the holding time is 7 hours, and the furnace pressure is 400Pa;
[0034] Si 3 N 4 -Si 3 N 4 Composite ceramics are tested for dielectric properties, and the test frequency is 8.2-12.4GHz.
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