Airglow-discharge low-temperature plasma coating technique

A technology of low-temperature plasma and atmospheric glow, which is applied in the direction of fusion spraying, metal material coating process, coating, etc., can solve the problems of complex, damaged substrate preparation process, and low coating temperature, so as to expand the scope of use and reduce the The complexity of the preparation process and the good coating effect

Active Publication Date: 2013-04-24
INFINITE MATERIALS TECH
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  • Claims
  • Application Information

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Problems solved by technology

[0005] The purpose of the present invention is to provide an atmospheric glow discharge low-temperature plasma coating technology for the deficiencies of the above-mentioned vacuum plasma coating technology and atmospheric pressure high-temperature plasma coating technology. This technology has a low coating temperature and can effectively solve the problem of excessive coating temperature in the coating field Will damage the substrate and complicate the preparation process

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Embodiment 1

[0027] In this embodiment, the selected gas is N 2 ; The excitation source is a DC pulse power supply; the electrode material is made of graphite electrodes, and the discharge tube is made of polytetrafluoroethylene. The coating process is as follows:

[0028] S1, the N 2 The gas inlet 7 leads to the discharge tube 1, and the gas flow rate is 6-20L / min; a DC pulse power supply is added to the anode 5 and cathode 6, the voltage range is 2-15KV, the pulse frequency range is 7KHz-50KHz, and the pulse voltage width 600nm-80μm; the temperature of the generated low-temperature plasma 3 is 10-100°C. S2, the powder feeding rate of the powder material introduced through the powder inlet 4 is 10-25g / min, and the local temperature rises under the action of the low-temperature plasma 3; S3, the powder material melts and accelerates out of the nozzle 10, depositing The thin film 2 is deposited on the surface of the substrate 1; the distance between the nozzle 10 and the substrate 1 is 1...

Embodiment 2

[0030] In this embodiment, the gas is Ar; the excitation source is a radio frequency power supply; the electrode material is a tungsten electrode, and the discharge tube is made of alumina. The coating process is as follows:

[0031] S1, Ar is passed into the discharge tube 1 from the gas inlet 7, and the gas flow rate is 10-20L / min; add a radio frequency power supply to the anode 5 and the cathode 6, the power supply power is 10-300mW, and the pulse frequency range is 7.17MHz-15MHz, The preferred frequency is 13.56MHz; the temperature of the generated low-temperature plasma 3 is 50-150°C. S2. The powder feeding rate of the powder material introduced through the powder inlet 4 is 10-35g / min, and the local temperature rises under the action of the low-temperature plasma 3 . S3. The powder material is melted and accelerated out of the nozzle 10, and deposited on the surface of the substrate 1 to form a thin film 2; the distance between the nozzle 10 and the substrate 1 is 100mm...

Embodiment 3

[0033] In this embodiment, the selected gas is N 2 Mixed gas with Ar; the excitation source adopts AC power; the electrode material adopts copper electrode, and the discharge tube is made of boron nitride material. The coating process is as follows:

[0034] S1, the N 2 Pass the gas inlet 7 into the discharge tube 1, and the gas flow rate is 6-20L / min; Ar is passed into the discharge tube 1 through the gas inlet 7, and the gas flow rate is 1-10L / min; AC power supply, the voltage range is 5-50KV, the pulse frequency range is 20KHz-50KHz; the temperature of the generated low-temperature plasma 3 is 70-100°C. S2. The powder feeding rate of the powder material introduced through the powder inlet 4 is 10-35g / min, and the local temperature rises under the action of the low-temperature plasma 3 . S3. The powder material is melted and accelerated out of the nozzle 10, and deposited on the surface of the substrate 1 to form a thin film 2; the distance between the nozzle 10 and the s...

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Abstract

The invention provides an airglow-discharge low-temperature plasma coating technique, belonging to the field of plasma coating. The technique can effectively solve the problems of the overhigh coating temperature can damage the substrate and the preparation technique is complex in the field of coating. The technique comprises the following steps: a. low-temperature plasma breakdown by electrifying a discharge tube: gas introduced from a gas source reaches breakdown voltage under the action of a power source with an excitation source, and discharge is initiated to excite and generate low-temperature plasma; b. introduction of a powder material: the fed powder material is locally heated to be molten under the action of the low-temperature plasma and is accelerated; and c. injection and coating of low-temperature plasma: the powder material and the low-temperature plasma are injected together and deposited on the substrate surface to implement coating. The invention can be widely used for preparing metal materials, semiconductor materials, compound materials, polymers and other materials in the fields of printing electronics, 3D printing and the like.

Description

technical field [0001] The invention relates to the field of plasma coating, in particular to an atmospheric glow discharge low-temperature plasma coating technology. Background technique [0002] The current vacuum coating technology, especially plasma vacuum coating technology, plays an extremely important role in the fields of electronic component manufacturing, circuit electronics, solar cells and other fields. Compared with the non-vacuum preparation technology, although it has the advantages of dense film growth, fast preparation speed, and easy control of film composition, but at the same time, due to the complexity of the equipment, the material preparation cost is usually high and the operation is complicated, which is not conducive to reducing the material cost. However, the currently widely used non-vacuum plasma coating technology uses thermal plasma, which has high temperature and high requirements for the film deposition substrate. The use of substrate material...

Claims

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Application Information

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IPC IPC(8): C23C4/12C23C4/134
Inventor 向勇闫宗楷朱焱麟常小幻
Owner INFINITE MATERIALS TECH
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