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Thermoplastic polyimide resin and preparation method thereof

A technology of polyimide resin and soluble polyimide resin, applied in the field of thermoplastic polyimide resin and its preparation, can solve problems such as loss of melt flow behavior, and achieve easy processing, low cost and ideal mechanical properties Effect

Active Publication Date: 2015-05-27
山东君昊高性能聚合物有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Although the usual thermoplastic polyimide resins can be melt-processed, there are still certain differences compared with traditional thermoplastic polymer materials, mainly as follows: the melt flow behavior of thermoplastic polyimide resins is only in the initial or limited During the heating process, after the initial or limited number of heating, its melt flow behavior is basically or completely lost

Method used

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  • Thermoplastic polyimide resin and preparation method thereof
  • Thermoplastic polyimide resin and preparation method thereof
  • Thermoplastic polyimide resin and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0058] At room temperature, 1.7044 g (0.004 mol) of 4,4'-bis(3-aminophenoxy)diphenyl sulfone (m-BAPS) was dissolved in 10.3076 g of N,N-dimethylacetamide In the polymerization reaction bottle, stir mechanically, add 0.8725 g (0.004 mole) pyromellitic dianhydride (PMDA) in batches after complete dissolution, fill with nitrogen protection and continue stirring for 12 hours to obtain a polyamic acid solution with a solid content of 20%. .

[0059] Pour the obtained polyamic acid solution into ethanol to gel into a solid, and soak it for 24 hours, wash it with ethanol once every 12 hours, centrifuge the soaked solid, and dry it at 110°C, then pulverize it and heat it Cyclization: keep at 80°C for 2 hours, step up the temperature to 110°C, 140°C, 170°C, 200°C, and 230°C, and keep at each step for 30 minutes, then cool naturally, and finally grind at high speed to obtain polyimide resin powder.

[0060] The molecular structure of transparent polyimide film is as follows in the pres...

Embodiment 2

[0064] At room temperature, 1.7044 g (0.004 mol) of 4,4'-bis(3-aminophenoxy)diphenyl sulfone (m-BAPS) was dissolved in 10.3076 g of N,N-dimethylacetamide In the polymerization reaction bottle, stir mechanically, add 0.8725 g (0.004 mole) pyromellitic dianhydride (PMDA) in batches after complete dissolution, fill with nitrogen protection and continue stirring for 12 hours to obtain a polyamic acid solution with a solid content of 20%. .

[0065] Add 1 g of acetic anhydride and 0.8 g of triethylamine to the polyamic acid solution under stirring. After stirring for 1 hour, it gels in ethanol to obtain a solid, and soaks it for 24 hours, during which time it is washed with ethanol every 12 hours. The soaked solid is centrifuged and dried at 110°C, then pulverized, and heated for cyclization: maintain at 80°C for 2 hours, step by step increase the temperature to 110°C, 140°C, 170°C, 200°C, and 230°C, and maintain each step 30 minutes, then naturally cooled, and finally high-speed ...

Embodiment 3

[0070] At room temperature, 1.7044 g (0.004 mol) of 4,4'-bis(3-aminophenoxy)diphenylsulfone (m-BAPS) was dissolved in 11.5252 g of N,N-dimethylacetamide Add 1.1769 g (0.004 mol) of 3,3',4,4'-biphenyltetracarboxylic dianhydride (BPDA) in batches after complete dissolution, and continue stirring for 12 hours under nitrogen protection. A polyamic acid solution with a solid content of 20% was obtained.

[0071] Pour the obtained polyamic acid solution into ethanol to gel into a solid, and soak it for 24 hours, wash it with ethanol once every 12 hours, centrifuge the soaked solid, and dry it at 110°C, then pulverize it and heat it Cyclization: keep at 80°C for 2 hours, step up the temperature to 110°C, 140°C, 170°C, 200°C, and 230°C, and keep at each step for 30 minutes, then cool naturally, and finally grind at high speed to obtain polyimide resin powder.

[0072] The molecular structure of polyimide resin in the present embodiment is as follows:

[0073]

[0074] The glass t...

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Abstract

The invention discloses a thermoplastic polyimide resin and a preparation method thereof. The polyimide resin has the following repeat structural units, and R represents a dianhydride residue. The thermoplastic polyimide resin prepared by the invention can be used at 200 DEG C for a long time; raw materials for synthesis of the resin are low-cost and easily available. The obtained resin powder can be easily dissolved in a solvent with low boiling point for processing, and can also be subjected to injection molding or molding pressing shaping at 300 DEG C, and has ideal mechanical properties.

Description

Technical field: [0001] The invention belongs to the technical field of polymer materials, and relates to a thermoplastic polyimide resin and a preparation method thereof. The thermoplastic polyimide resin contains a novel diamine monomer. technical background: [0002] Polyimide (PI) is highly valued by people for its excellent high temperature resistance, low temperature resistance, solvent resistance, radiation resistance, outstanding mechanical strength and dielectric properties, and has been widely used in aerospace, aviation, space, Many high-tech fields such as automobiles, electronics, and electrical appliances. However, difficulty in processing and high manufacturing costs have always been two key factors restricting its rapid development. Research and development of melt-processable and soluble thermoplastic polyimide is one of the main methods to improve the processing performance of polyimide materials and reduce manufacturing costs. [0003] Many polyimide mat...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G73/10
Inventor 张子龙张华伟屠国力
Owner 山东君昊高性能聚合物有限公司