Preparation method of compound type metal ceramic substrate provided with circuit and structure thereof
A composite metal and metal substrate technology, applied in the direction of circuits, electrical components, semiconductor devices, etc., can solve the problems of heavy weight, complicated manufacturing process, and time-consuming manufacturing methods of ceramic radiators, so as to avoid thermal resistance effect and reduce The effect of defect rate and process simplification
Inactive Publication Date: 2013-05-22
TAIWAN PURITIC
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Problems solved by technology
However, such a production method is time-consuming, the manufacturing process is complicated, and the weight of the produced ceramic radiator itself is relatively heavy
Therefore, it can be seen that the problems and deficiencies derived from the existing LED heat sinks are not a good design and need to be improved urgently.
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[0046] The present invention will be further described below with specific embodiment:
[0047] Please refer to figure 1 , the preparation method of the composite metal-ceramic substrate with circuit of the present invention comprises the following steps:
[0048] a, providing a metal substrate with at least one through hole;
[0049] b. Pre-treatment of the metal substrate, including degreasing, decontamination or rust removal, etc., to remove various substances (including organic substances) and oil stains on the surface of the metal substrate;
[0050] c. Use plasma spraying, spraying or plasma oxidation sintering, and use plasma treatment with different voltage power, current size, and film wave frequency to spray and sputter ceramic materials onto the surface of the metal substrate, and modify the changes in electric power and frequency so that The ceramic on the surface of the metal substrate is even and flat, so that the thickness of the ceramic layer is controlled; ...
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Abstract
The invention discloses a preparation method of a compound type metal ceramic substrate provided with a circuit and a structure thereof. The preparation method of the compound type metal ceramic substrate provided with the circuit comprises the steps: a, providing a metal substrate; b, carrying out pretreatment on the metal substrate to remove various substances and greasy dirt on the surface of the metal substrate; c, spraying and sputtering ceramic materials to the surface of the metal substrate; d, carrying out drying process on the metal substrate; and e, forming a needed circuit on a ceramic layer. Through the steps, the compound type metal ceramic substrate is obtained, wherein the circuit is arranged on the top face of the compound type metal ceramic substrate and the compound type metal ceramic substrate is good in heat dissipation.
Description
technical field [0001] The invention relates to a manufacturing method and structure of a composite metal-ceramic substrate with a circuit, which is especially suitable for the manufacturing method of the circuit substrate. Background technique [0002] LED has the advantages of low power consumption, low heat generation, long service life, fast start-up speed, rich colors and good brightness, and can save a lot of power consumption of lighting fixtures. Therefore, LED has gradually replaced traditional lamps and become the mainstream of the future market. Although LEDs have the above-mentioned advantages, when LEDs are used for lighting purposes, LED lamps are mainly formed by modularizing multiple LED lamps, and the required lighting is provided by modular LED lamps, and LED lamps provide lighting when they emit light. At the same time, heat energy will also be generated. If the generated heat energy cannot be effectively dissipated, it will affect the service life of LED...
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IPC IPC(8): H01L33/00
Inventor 方学智邓焕平洪迪恩
Owner TAIWAN PURITIC