Gallium-nitride-based high electronic mobility transistor structure with barrier layer and manufacture method thereof
Patent Information
- Authority / Receiving Office
- CN · China
- Current Assignee / Owner
- INST OF SEMICONDUCTORS - CHINESE ACAD OF SCI
- Publication Date
- 2013-05-29
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Abstract
Description
technical field
[0001] The invention belongs to the technical field of semiconductors, in particular to a gallium nitride-based high electron mobility transistor (HEMT) structure and manufacturing method with a potential barrier layer. The transistor uses a combination of non-intentionally doped aluminum gallium nitride and aluminum nitride The new barrier layer and high-mobility gallium nitride channel layer can significantly increase the two-dimensional electron gas surface density and the confinement effect on the two-dimensional electron gas, reduce the influence of the heterojunction interface on the electronic properties of the channel, and improve The performance of the developed device. Background technique
[0002] Gallium nitride-based semiconductor materials have excellent physical and chemical properties, and are especially suitable for the preparation of high-frequency, high-power, high-electron mobility transistors. GaN-based high electron mobility transistors...