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Thermosetting resin composition and laminated plate and circuit board employing same

A composition and resin technology, applied in the direction of circuit substrate materials, printed circuit components, etc., can solve the problems of increasing hygroscopicity, and achieve the effect of high heat resistance

Active Publication Date: 2015-06-17
ELITE MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The prior art generally uses epoxy resin and phenol novolac resin hardener with hydroxyl (-OH) as the raw material for thermosetting resin composition. The combination of phenolic resin and epoxy resin will open the epoxy group to form another hydroxyl group. Hydroxyl itself will increase the dielectric constant and dielectric loss value, and it is easy to combine with water to increase hygroscopicity

Method used

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  • Thermosetting resin composition and laminated plate and circuit board employing same
  • Thermosetting resin composition and laminated plate and circuit board employing same
  • Thermosetting resin composition and laminated plate and circuit board employing same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0048] Example 1 (E1)

[0049] A resin composition comprising the following components:

[0050] (A) benzoxazine resin shown in formula one of 100 parts by weight;

[0051] (B) 20 parts by weight of phenolic resin (Phenol novolac).

Embodiment 2

[0052] Example 2 (E2)

[0053] A resin composition comprising the following components:

[0054] (A) the dicyclopentadiene epoxy resin (HP-7200) of 100 weight parts;

[0055] (B) benzoxazine resin shown in formula three of 75 parts by weight;

[0056] (C) 10 parts by weight of amino triazine phenolic resin (Amino triazine novolac, ATN);

[0057] (D) the DOPO-BPAN resin flame retardant of 30 weight parts;

[0058] (E) 80 parts by weight of silicon dioxide (Silica) inorganic filler;

[0059] (F) 0.3 parts by weight of the 2E4MI catalyst;

[0060] (G) 20 parts by weight of methyl ethyl ketone (MEK).

Embodiment 3

[0061] Example 3 (E3)

[0062] A resin composition comprising the following components:

[0063] (A) the dicyclopentadiene epoxy resin (HP-7200) of 50 weight parts;

[0064] (B) bisphenol A epoxy resin (BE-188E) of 50 weight parts;

[0065] (C) bisphenol A benzoxazine resin (BPA-BZ) of 40 weight parts;

[0066] (D) benzoxazine resin shown in formula three of 35 parts by weight;

[0067] (E) 25 parts by weight of styrene maleic anhydride resin (Styrene-maleic anhydride, SMA);

[0068] (F) the phosphazene compound (SPB-100) flame retardant of 30 weight parts;

[0069] (G) 70 parts by weight of fused silica (Fused silica) inorganic filler;

[0070] (H) 0.35 parts by weight of the 2E4MI catalyst;

[0071] (1) 20 parts by weight of methyl ethyl ketone (MEK).

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Abstract

The invention provides a benzoxazine resin containing a structure of a naphthalene ring, biphenyl or an anthracene ring, and a resin composition, a laminated plate and a circuit board which contain the benzoxazine resin. By virtue of the resin composition comprising the benzoxazine resin with the specific structure, low dielectric constant, low dielectric loss, high rigidity and high heat resistance can be achieved; a semi-cured film or a resin film can be manufactured, and further an object of applying the composition in the laminated plate and the circuit board can be achieved.

Description

technical field [0001] The invention relates to a benzoxazine resin, in particular to a benzoxazine resin applied to laminates and circuit boards. Background technique [0002] In response to the world's environmental protection trends and green regulations, Halogen-free is the current environmental protection trend of the global electronics industry. Countries around the world and related electronics manufacturers have successively formulated mass production schedules for halogen-free electronic products. After the implementation of the European Union's Restriction of Hazardous Substances (RoHS), substances including lead, cadmium, mercury, hexavalent chromium, polybrominated biphenyls and polybrominated diphenyl ethers are no longer used in the manufacture of electronic products or its components. Printed Circuit Board (PCB) is the basis of electronic and electrical products. Halogen-free PCBs are the first priority to be regulated. International organizations have strict...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G73/06C08L79/04C08L63/00C08L61/06C08K3/22H05K1/03
Inventor 余利智李泽安
Owner ELITE MATERIAL