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Novel water-soluble plated-copper protective agent and preparation method thereof

A water-soluble and protective agent technology, applied in the coating process of metal materials, etc., can solve the problems of poor salt spray resistance on the surface of copper-plated products, increase the contact resistance of electrical contact surfaces, and destroy the atmospheric ozone layer, so as to improve salt spray resistance And anti-discoloration performance, reduce adverse effects, ensure the effect of conductivity

Active Publication Date: 2013-06-12
西安创联华特表面处理技术有限责任公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the organic solvent used in this method is a halogen-containing volatile liquid, which has been banned because of its destructive effect on the atmospheric ozone layer. From January 1, 2011, all countries that signed the "Montreal Treaty" (my country Belonging to one of the signatories), the production and use of such organic solvents are prohibited
[0005] The second approach focuses on surface passivation
Although this method can make the passivation oxide film formed on the copper-plated surface uniform and dense, it greatly increases the contact resistance of the electrical contact surface due to its thick film layer, and the surface of the copper-plated product has poor salt spray resistance. Therefore, it is not suitable for some electronic components with high electrical performance requirements

Method used

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  • Novel water-soluble plated-copper protective agent and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0051] Example 1 Prepare 1000 g of protective agent.

[0052] The ingredients are prepared according to the following mass ratios: rare earth salt lanthanum chloride 6g, neodymium chloride 6g; organic corrosion inhibitor benzotriazole 75g, imidazole 75g, polyethylene wax 100g, surfactant OP10150g, the rest is deionized 588g of water.

[0053] The preparation process of this embodiment is:

[0054] 1. Add 40% deionized water into the reactor and heat to 45~50℃;

[0055] 2. Accurately weigh 6g each of the rare earth salt lanthanum chloride and neodymium chloride, add the above-mentioned deionized water, stir to dissolve, and obtain a colorless and transparent solution A;

[0056] 3. Accurately weigh 75g of organic corrosion inhibitor benzotriazole and add it to the reaction solution, stir at 45~50℃ until it dissolves, and obtain light yellow solution B;

[0057] 4. Accurately weigh 75g of the organic corrosion inhibitor imidazole and 150g of the surfactant OP10. After mixing, heat at 40~4...

Embodiment 2

[0069] Example 2 Prepare 1000 g of protective agent.

[0070] The ingredients are prepared according to the following mass ratio: rare earth salt yttrium chloride 2.5g, neodymium chloride 2.5g; organic corrosion inhibitor benzotriazole 75g, dodecylamine 150g, polyethylene wax 150g, surfactant OP10200g, the rest is deionized water 420g.

[0071] The preparation process of this embodiment is:

[0072] 1. Add 60% deionized water into the reactor and heat to 45~50℃;

[0073] 2. Accurately weigh 2.5g each of the rare earth salt yttrium chloride and neodymium chloride, add deionized water at 45~50℃, stir to dissolve, and obtain a colorless transparent solution A;

[0074] 3. Accurately weigh 75g of organic corrosion inhibitor benzotriazole and add it to the reaction solution, stir at 45~50℃ until it dissolves, and obtain light yellow solution B;

[0075] 4. Accurately weigh 150g of organic corrosion inhibitor laurylamine and 10200g of surfactant OP. After mixing, heat at 40~45℃ until the mixt...

Embodiment 3

[0080] Example 3 Prepare 1000 g of protective agent.

[0081] The ingredients are prepared according to the following proportions: rare earth salt yttrium chloride 10g, lanthanum chloride 10g; organic corrosion inhibitor benzotriazole 50g, phenylimidazole 50g, dodecylamine 100g, polyethylene wax 200g, surface Active agent OP10180g, the rest is 400g deionized water.

[0082] The preparation process of this embodiment is:

[0083] 1. Add 50% deionized water into the reactor and heat to 45~50℃;

[0084] 2. Accurately weigh 5g each of the rare earth salt yttrium chloride and lanthanum chloride, add deionized water at 45~50℃, stir to dissolve, and obtain a colorless transparent solution A;

[0085] 3. Accurately weigh 50g of the organic corrosion inhibitor benzotriazole, add it to the reaction solution, stir at 45~50℃ until it dissolves, and obtain light yellow solution B;

[0086] 4. Accurately weigh 50g of organic corrosion inhibitor phenylimidazole, 100g of dodecylamine, and surfactant OP...

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Abstract

The invention relates to a novel water-soluble plated-copper protective agent and a preparation method thereof. A use method of the novel water-soluble plated-copper protective agent comprises the following steps that a solute rare-earth salt and an organic inhibitor form a rare-earth complex skeleton on the surface of plated copper in the presence of water as a solvent; the organic inhibitor on the surface and the rare-earth complex skeleton on the surface of the plated copper are combined into a self-assembled film; and an organic polymer film is covered on the self-assembled film by physical absorption. The three-dimensional film structure formed on the surface of the plated copper can effectively prevent the corrosion caused by harmful gas in air on the surface of the plated copper and improve salt mist resistance and anti-discoloration performances of the surface of the plated copper. A nonpolar molecule group at the end of the self-assembled film effectively improves lubricity of the surface of the plated copper, reduces an insertion and extraction force and does not influence electrical conductivity and welding performances of the plated copper.

Description

Technical field [0001] The invention relates to a copper-plated surface protective agent and a preparation method thereof. The surface protective agent is suitable for a copper-plated surface of a filter or a printed circuit board in the communication industry. Background technique [0002] The cover plates, cavities and connectors of communication modules widely used in the communication industry are mostly made by silver plating. With the continuous rise of international silver prices, the traditional silver plating process is changing to a relatively low-cost copper plating process. However, because the reactivity of metallic copper is much higher than that of silver, it is easy to react with water and SO in the air. 2 , H 2 S, NO 2 Corrosion products or oxides are generated due to the action of other media, which increases the contact resistance of communication devices, resulting in unstable or interrupted electrical signals, and even accidents. Therefore, the protection of ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C22/68
Inventor 苏振萍李媛
Owner 西安创联华特表面处理技术有限责任公司
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