Silent non-power-consumption heat dissipation type computer mainframe

Abstract

The invention discloses a silent non-power-consumption heat dissipation type computer mainframe, wherein heating components in the computer mainframe are directly and fixedly arranged on a case wall board with a heat dissipation function; the heat conducted to the outer surface of a case is brought away through external natural air flow to perform physical heat dissipation; and the silent non-power-consumption heat dissipation type computer mainframe is characterized in that no additional power consumption exists in the entire heat dissipation process. The computer case wall board is made of metal with high thermal conduction ratio; and a heat dissipation toothed lattice for increasing the heat dissipation area is arranged on the outer side of the computer case wall board according to a heat dissipation requirement. The heat of the heating components in the mainframe is directly conducted to the exterior of a computer in real time through the heat dissipation wall board, so that infrasonic wave and noise caused by a fan are avoided, meanwhile, the stability performance for operation of the computer is improved, and the service life of the electronic components in the computer is effectively prolonged. Meanwhile, electromagnetic radiation in the computer is effectively obstructed by the metal wall board with high thermal conduction ratio and the heat dissipation toothed lattice of the metal wall board. The silent non-power-consumption heat dissipation type computer mainframe has a good actual measurement effect in the aspects of performance, energy conservation and environmental protection.

Description

technical field [0001] The invention belongs to the technical field of computers, and in particular relates to a quiet, power-dissipating and heat-dissipating computer host in the technical field of computers. technical background [0002] At present, the host cooling system of computers generally adopts driving fans or liquid cooling technology to cool down related heating components, but there are certain technical defects: [0003] 1. Defects of air cooling technology: [0004] 1. During the heat dissipation process of the fan, the power supply and related lines in the host computer will increase the load and generate secondary heat energy. [0005] 2. The fan itself increases power consumption and increases the power load, which is not energy-saving and environmentally friendly. [0006] 3. The fan generates static electricity when it rubs against the air and the dust in the air, and absorbs the dust particles. After a long time of operation, it will cause dirt accumul...

AI Technical Summary

Problems solved by technology

[0005] 2. The fan itself increases power consumption and increases the power load, which is not energy-saving and environmentally friendly

[0006] 3. The fan generates static electricity when it rubs against the air and the dust in the air, and absorbs dust particles. After a long time of operation, it will cause accumulation of dirt and reduce the heat dissipation effect. In addition, it is easy to cause a short circuit in a humid environment, posing a safety hazard

[0007] 4. Heat dissipation delay. Generally, the fan-type fan heat is controlled by the temperature sensor to control the fan speed. When the temperature of the components increases, the information is provided to the sensor, and the sensor commands to change the fan speed. This process will cause a heat dissipation delay. In fact, the high temperature A certain amount of wear and tear has been produced on the components, which reduces the life of the components

[0008] 5. The fan produces noise and infrasonic waves during operation, which will cause harm to the human body

[0010] Some computer mainframes adopt liquid cooling technology. Although some dust absorption is avoided, there is still power consumption during the operation of the liquid circulation pump, which cannot make beneficial improvements in energy saving and environmental protection. The cooling and heat dissipation circulation pipeline is complicated and difficult to implement, so liquid cooling is generally only used for cooling the CPU and GPU. In general, the power supply part still uses fans to cool down.

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