Modifying method for porous substrate and modified porous substrate

A technology for porous substrates and modification methods, applied in the field of modification methods and modified porous substrates, can solve the problems of reduced service life of palladium membranes, reduction of dense palladium membrane thickness, poor adhesion, etc., and achieve good adhesion properties, reducing film thickness
CN103182249AActive Publication Date: 2013-07-03IND TECH RES INST

Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
IND TECH RES INST
Publication Date
2013-07-03

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Abstract

The invention provides a modifying method for a porous substrate, comprising the steps of: coating at least one metal hydroxide layer on a porous substrate;, and calcining the porous substrate having the metal hydroxide layer to transform the metal hydroxide layer into a metal oxide layer having a continuous phase, and forming a modified porous substrate. The present invention also provides a modified porous substrate.
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Description

technical field

[0001] The invention relates to a method for modifying a porous substrate and the modified porous substrate, in particular to a method for modifying a porous substrate applicable to gas separation. Background technique

[0002] Hydrogen energy has low environmental hazards and can be continuously recycled and utilized. It has become a promising new energy source in recent years. Steam recombination is the main hydrogen production reaction, however, the steam recombination reaction is a highly endothermic reaction, which requires very high reaction temperature to achieve sufficient conversion due to thermodynamic constraints. When the reaction pressure is 1000kPa and the water / methane ratio is 3, the required reaction temperature is 850°C to achieve 90% methane conversion. If 90% of the hydrogen can be removed in time in the steam reforming reaction, the required reaction temperature is only 500°C. Palladium or its alloy membrane can be used to separate and ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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