A kind of high thermal conductivity insulating composite material and preparation method thereof

An insulating composite material and a composite material technology are applied in the field of high thermal conductivity insulating composite materials and their preparation, which can solve the problems of low dielectric constant, unsuitable high thermal conductivity and the like, and achieve the effect of low dielectric constant.

Active Publication Date: 2016-01-20
GRIMAT ENG INST CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In order to solve the requirement that the existing high thermal conductivity composite material is not suitable for specific applications with high thermal conductivity, low dielectric constant and electrical insulation, the present invention provides a high thermal conductivity insulation composite material

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] The preparation method of the high thermal conductivity insulating composite material comprises the following steps:

[0021] Step 1: Prepare a diamond / copper composite material sample, the volume ratio of diamond to copper is 65%:1, and process it into Generally speaking, the shape of the composite material sample is not limited, and it is not limited to any thickness, but the preferred thickness is above 3mm;

[0022] Step 2: Coarse grinding, fine grinding, rough polishing, and fine polishing of the high thermal conductivity composite material sample;

[0023] Step 3: Use ion implantation technology to inject a carbon layer on the surface of the high thermal conductivity composite material sample; the carbon layer is used as a transition layer, and the thickness is less than 1 μm, usually tens of nanometers;

[0024] Step 4: Deposit an insulating AlN film on the surface of the high thermal conductivity composite material with a thickness of 100 μm by using magnetron...

Embodiment 2

[0027] The difference between this example and Example 1 is that the insulating film is prepared by CVD technology, the chemical vapor deposition rate exceeds 10 μm / hour, and the thickness is 100 μm. Other preparation steps are the same as in Example 1.

[0028] The composite material Tanδ≦6.8×10 after depositing the diamond film -2 (1MHz), the volume resistivity is 10 9 Ωcm, thermal conductivity 560W / mK.

Embodiment 3

[0030] The difference between this example and Example 1 is that the insulating film uses AlN and CVD diamond composite film, first deposits a 50 μm AlN film, and then deposits a 50 μm diamond film, and the chemical vapor deposition rate exceeds 10 μm / hour. 1 is the same. After depositing the composite film, the volume resistivity is 10 11 Ωcm, dielectric loss Tanδ≦6.3×10 -3 (1MHz), thermal conductivity 480W / mK.

[0031] In the preparation method of the present invention, in addition to the diamond / copper used in the embodiment, the high thermal conductivity composite material can also use carbon fiber / copper, diamond mixed particles / copper, carbon fiber mixed particles / copper, diamond / aluminum, diamond / silver and other particles Or fiber-reinforced copper, aluminum or silver high thermal conductivity, low expansion composite material; Insulation layer can also use boron nitride except aluminum nitride film, diamond film and diamond and aluminum nitride composite film adopte...

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PUM

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Abstract

The invention relates to a high heat conductivity insulation composite and a preparation method thereof, and belongs to the technical field of electronic packaging. The composite consists of a high heat conductivity composite and an insulation layer plated on the high heat conductivity composite, wherein the high heat conductivity composite is a composite of reinforced particles or fibers and a matrix; the matrix is copper, aluminum or silver; and the insulation layer is a diamond, aluminum nitride or boron nitride ceramic film or a composite film of diamond and aluminum nitride or boron nitride. The composite is prepared by depositing the insulation film on the surface of the high heat conductivity composite by a chemical vapor deposition technology. The high heat conductivity insulation composite achieves high heat conductivity and insulation under applications with specific insulating property requirements, and is applicable to integrated circuit systems, high-power or high power density devices and the like.

Description

technical field [0001] The patent of the invention relates to a high thermal conductivity insulating composite material and a preparation method thereof, belonging to the technical field of electronic packaging materials. Background technique [0002] In recent years, microelectronic devices are developing in the direction of high performance and high integration. Accompanied by the continuous increase in the heating power of electronic components, various microelectronic technology applications have also generated further demand and dependence on thermal management materials. . Although diamond / copper, SiC / Al and other composite materials have high thermal conductivity and suitable thermal expansion coefficient as a new generation of thermal management materials, they cannot be used for specific insulation or dielectric properties due to the existence of the metal matrix. application occasions. For example, in addition to electrical insulation, the integrated circuit subs...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01B17/62H01B19/00H01L23/29
Inventor 郭宏韩媛媛尹法章张习敏范叶明
Owner GRIMAT ENG INST CO LTD
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