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Copper foil surface passivation liquid and treatment method thereof, and treated copper foil

A treatment method and a technology of passivation solution, which are applied in the coating process of metal materials, etc., can solve the problems of large demand and poor economic efficiency of the electroplating process, and achieve the effect of maintaining the same physical properties

Inactive Publication Date: 2013-07-10
JIANGXI COPPER
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At the same time, the electroplating process has a large demand for energy, and it also has the characteristics of poor economy.

Method used

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  • Copper foil surface passivation liquid and treatment method thereof, and treated copper foil
  • Copper foil surface passivation liquid and treatment method thereof, and treated copper foil
  • Copper foil surface passivation liquid and treatment method thereof, and treated copper foil

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] Weigh benzotriazole and / or benzotriazole derivatives, dissolve in 1 liter of deionized water, stir until the solution is clear, then add soluble inorganic salts, start the configuration circulation pump, stir the solution evenly, and control the solution temperature At 25°C, start the passivation solution configuration pump, spray the passivation solution onto the foil surface through the spray pipe, squeeze the foil surface with the squeeze roller, squeeze the passivation solution evenly, and control the spraying time for about 2 seconds . The passivated copper foil is post-baked in an oven at 110°C for 2 seconds to form a dense anti-oxidation protective film on the surface of the foil. Put the copper foil in an oven and bake it at 160°C for 10 minutes, and there will be no color difference on the surface of the copper foil; the oxidation resistance of this layer can reach 10 minutes at 160°C.

[0022]

Embodiment 2

[0024] Weigh benzotriazole and / or benzotriazole derivatives, dissolve in 1 liter of deionized water, stir until the solution is clear, then add soluble inorganic salts and pyrophosphate, start the configuration circulation pump, and stir the solution evenly , the solution temperature is controlled at 45°C, start the passivation solution configuration pump, spray the passivation solution onto the foil surface through the spray pipe, squeeze the foil surface with the squeeze roller, squeeze the passivation solution evenly, and control the spraying time About 5 seconds. The passivated copper foil is post-baked in an oven at 160°C for 5 seconds to form a dense anti-oxidation protective film on the surface of the foil. . Put the copper foil in an oven and bake it at 160°C for 30 minutes or at 180°C for 10 minutes. There will be no color difference on the surface of the copper foil; minute.

[0025]

Embodiment 3

[0027] Weigh benzotriazole and / or benzotriazole derivatives, dissolve in 1 liter of deionized water, stir until the solution is clear, then add soluble inorganic salts, pyrophosphate and silane coupling agent, and start to configure the circulation pump , Stir the solution evenly, control the temperature of the solution at 40°C, start the passivation solution configuration pump, spray the passivation solution onto the foil surface through the spray pipe, squeeze the foil surface with the squeeze roller, squeeze the passivation solution Uniform, controlled spraying time is about 8 seconds. The passivated copper foil is post-baked in an oven at 170°C for 8 seconds to form a dense anti-oxidation protective film on the surface of the foil. . Put the copper foil in an oven and bake it at 213°C for 10 minutes. There will be no color difference on the surface of the copper foil, and the oxidation resistance of this layer can reach 10 minutes at 213°C.

[0028]

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Abstract

The invention provides a copper foil surface passivation liquid which comprises one or more compositions selected from benzotriazole and benzotriazole derivative, and one or two compositions selected from soluble zinc salt and soluble nickel salt and has the pH value of 1-7. A copper foil surface treatment method comprises the following steps of: (1) preserving the temperature of the passivation liquid at 25-45 DEG C; (2) spraying the passivation liquid to the surface of a copper foil for 2-10 seconds; (3) uniformly distributing the passivation liquid on the surface of the copper foil by a water extrusion roller; and (4) drying at the temperature of 110-180 DEG C for 2-10 seconds. The invention also provides the copper foil. The oxidization resistance temperature of the surface of the copper foil is 213 DEG C, and the oxidization resistance can be maintained for 120 minutes at the temperature of 213 DEG C. According to the conventional passivation technology, the surface of the copper foil is passivated by a chromium plating mode, and sexavalence chromium ions contained in the electroplating liquid pollute the environment; and the surface of the copper foil is passivated by the chromium-free passivation liquid, so that the waste liquid cannot pollute the environment.

Description

technical field [0001] The invention belongs to the field of copper foil surface passivation treatment, and in particular relates to a copper foil surface passivation solution and a passivation treatment process thereof. Background technique [0002] Benzotriazole is often used as a corrosion inhibitor. Corrosion inhibitors are also called corrosion inhibitors. They refer to the addition of certain substances (such as amines and quaternary ammonium salts) to the corrosive medium. The film increases the resistance to the reaction between the corrosive medium and the metal, reducing the corrosion rate of the metal or terminating the corrosion. Usually, benzotriazole often acts as a corrosion inhibitor in the circulating cooling water system. Generally, corrosion inhibitors need to work in the presence of water. In the production process of electrolytic copper foil, in order to improve the oxidation resistance of the surface of copper foil, the surface of copper foil is usuall...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C22/52C23C22/23
Inventor 王平黄永发
Owner JIANGXI COPPER
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