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Manufacturing method of printed wiring board and printed wiring board
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A technology of printed wiring and manufacturing method, which is applied in the manufacture of printed wiring boards and the field of printed wiring boards, can solve problems such as short circuits between wirings, and achieve the effect of excellent insulation reliability
Inactive Publication Date: 2016-01-20
FUJIFILM CORP
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Problems solved by technology
Due to this phenomenon, the eluted copper ions are reduced to copper compounds over time and grow into dendrites (dendrites), resulting in short circuits between wirings
Method used
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example 1
[0124] Copper wiring with L / S=23μm / 27μm was formed by the semi-additive method using a copper-clad laminate (MCL-E-679F manufactured by Hitachi Chemical Co., Ltd., substrate: glass epoxy substrate) core substrate. The core substrate is fabricated by the following method.
[0125]After the copper foil laminate was acid-cleaned, washed with water, and dried, a dry film resist (DFR, trade name; RY3315, Hitachi Chemical Co., Ltd. Industrial Co., Ltd.) laminated on the copper foil laminated board. After lamination, use an exposuremachine with a central wavelength of 365nm at 70mJ / cm 2 Under the conditions, the copper pattern forming part is mask-exposed. Then, it was developed with a 1% sodiumbicarbonateaqueous solution, and washed with water to obtain a plating resist pattern (resist pattern).
[0126] Electroplating is performed on the copper exposed between the resist patterns after plating pretreatment and water washing. At this time, copper (II) sulfuric acid acidic so...
（ example 2）
[0139] Using an aqueous solution (solvent: water, liquid temperature: 25°C, pH: 6) containing 1,2,4-triazole in which the content of 1,2,4-triazole is 2.5% by mass based on the total amount of the aqueous solution, Instead of the aqueous solution containing 1,2,3-triazole used in Example 1, except that the core substrate was immersed in this aqueous solution for 45 seconds, a printed wiring board was produced in the same procedure as Example 1. The results are summarized in Table 1.
（ example 3）
[0141] Use an aqueous solution containing 1,2,3-triazole and 1,2,4-triazole (solvent: water, liquid temperature: 25°C, pH: 6) instead of the one used in Example 1 containing 1,2, Except for the aqueous solution of 3-triazole, the printed wiring board was manufactured according to the procedure similar to Example 1. The results are summarized in Table 1.
[0142] In addition, the content of 1,2,3-triazole in the treatment liquid was 2.5% by mass based on the total amount of the aqueous solution, and the content of 1,2,4-triazole was 2.5% by mass relative to the total amount of the aqueous solution.
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Abstract
The purpose of the present invention is to provide a method for manufacturing a printed wiring board having excellent reliability in terms of insulation between wiring. The method for manufacturing a printed wiring board comprises: a layer forming step in which a substrate and a core substrate that is provided on the substrate and contains copper or copperalloy wiring are brought into contact with a treatment liquid which contains 1,2,3-triazole and / or 1,2,4-triazole and exhibits pH 5 to 12, the core substrate is washed with solvent, and a copperiondiffusion suppression layer which contains 1,2,3-triazole and / or 1,2,4-triazole is formed on the surface of the copper or copper alloy wiring; and an insulating layer forming step in which, after the layer forming step, an insulating layer is formed on the core substrate on which the copper iondiffusion suppression layer has been provided.
Description
technical field [0001] The present invention relates to a method of manufacturing a printed wiring board and a printed wiring board. Background technique [0002] In recent years, along with the requirement for higher functionality of electronic equipment, the high-density integration and high-density mounting of electronic parts have progressed, and the printed wiring boards used in these electronic parts have also been miniaturized and high-density. progress in densification. Under such circumstances, the intervals between the wirings on the printed wiring board are further narrowed, and further improvement in the insulation reliability between the wirings is required in order to prevent short circuits between the wirings. [0003] It is known that migration of so-called copper ions is one of factors that hinder the insulation between copper and copper alloy wirings. This is a phenomenon in which, when a potential difference occurs between wiring circuits, etc., copper c...
Claims
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