Environment-friendly II-VI class soft fragile crystal grinding and polishing method

A II-VI, green and environmentally friendly technology, applied in the direction of grinding equipment, grinding machine tools, metal processing equipment, etc., can solve the problems of scratches that are difficult to remove, micro deformation, micro scratches, etc.

CN103203681AInactive Publication Date: 2013-07-17DALIAN UNIV OF TECH
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
Publication Date
2013-07-17
Estimated Expiration
Not applicable · inactive patent
Patent Text Reader

Abstract

The invention belongs to the technical field of processing and manufacturing of II-VI class soft fragile crystals and discloses an environment-friendly II-VI class soft fragile crystal grinding and polishing method. The method is characterized in that samples are II-VI class soft fragile crystals, waterproof sand paper is made by adopting fixed abrasive, a fixed abrasive millstone is taken as a grinding tool, abrasive is one of alumium oxide, ceric oxide and silicon dioxide, the grain size is 2000-5000, the rotating speed of both a workpiece and a grinding disc is 40-80rpm, the pressure is 15-20kPa, grinding fluid is deionized water, grinding time is 3-10min, chemical mechanical polishing solution is composed of silica solution and hydrogen peroxide, the pH value of the silica solution is 6-8, the grain size of silicon dioxide is 50-80nm, pH regulator is one of orange juice, grapefruit juice, haw juice, tomato juice and lemon juice, the pH value of the polishing solution after being adjusted is 4-6, the rotating speed of both the workpiece and a polishing disc is 40-80rpm, the pressure is 20-30kPa, and the polishing time is 20-40min. The environment-friendly II-VI class soft fragile crystal grinding and polishing method has the advantage that environment-friendly grinding and polishing of the II-VI class soft fragile crystals are realized.
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Description

technical field

[0001] The invention discloses a green and environment-friendly grinding and polishing method for group II-VI soft and brittle crystals, which belongs to the technical field of processing and manufacturing II-VI group soft and brittle crystals, and in particular relates to a method for processing semiconductor wafers of II-VI group soft and brittle crystals. Background technique

[0002] II-VI group soft and brittle crystals are widely used in military, national defense, aerospace and other high-tech fields, and have become the focus and hotspot of research at home and abroad. CdZnTe and HgCdTe are typical representatives of II-VI group soft and brittle crystals. Cadmium zinc telluride is the preferred material for room temperature nuclear radiation detectors, and it is also an ideal material for mercury cadmium telluride infrared thin film substrates. Mercury cadmium telluride is the material of choice for infrared detectors, especially the most widely used...

Examples

Embodiment Construction

[0016] The specific implementation manner of the present invention will be described in detail below in conjunction with the technical solutions.

[0017] Processing Wafers to Cd 0.96 Zn 0.04 Te(111) single wafer, the length, width and height are 10mm, 10mm and 1mm respectively. First, stick three cadmium zinc telluride wafers on a round aluminum alloy counterweight plate with paraffin wax, and evenly distribute them on the edge circumference. The aluminum alloy weight plate has a diameter of 80 mm and a thickness of 12 mm. The pressure is applied on the aluminum alloy weight plate until 17 kPa, and the pressurization method is to increase the same weight plate and string them together with bolts. Put #3000 corundum waterproof sandpaper on the glass disc, fix it with bolts and pressure ring, then put the glass disc on the cast iron plate, fix the pressure ring with bolts.

[0018] When grinding, the rotating speed of the weight plate and the sandpaper is 80 rpm, and the gr...