Conductive particles, insulating-coated conductive particles, and anisotropic conductive adhesives
A technology of conductive particles and adhesives, applied in the direction of conductive adhesives, conductive connections, conductive materials dispersed in non-conductive inorganic materials, etc., can solve the problems of easy aggregation of particles and achieve less pinholes and low resistance value Effect
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment
[0112] Hereinafter, an Example and a comparative example are given, and the content of this invention is demonstrated more concretely. In addition, this invention is not limited to the following Examples.
[0113]
[0114] (Process a) (Pretreatment process)
[0115] 2 g of cross-linked polystyrene particles with an average particle diameter of 3.8 μm was added to 100 mL of a palladium catalyst solution containing 8% by weight of Atotech Neogant 834 (Atotech Neogant 834) (manufactured by Atotech Japan Co., Ltd., trade name) as a palladium catalyst. , was stirred at 30° C. for 30 minutes, filtered through a φ3 μm membrane filter (manufactured by Millipore Corporation), and washed with water. Thereafter, the resin particles were added to a 0.5% by weight dimethylamine borane solution adjusted to pH 6.0 to obtain resin particles with activated surfaces. Thereafter, the surface-activated resin particles were immersed in 20 mL of distilled water and ultrasonically dispersed.
...
Embodiment 2
[0133] In the plating process of the (step b) of embodiment 1, the build-up bath liquid is changed to the build-up bath liquid shown in Table 1, and the supplementary liquid A and B not containing nickel are respectively changed to 830mL, in addition, All were carried out in the same manner as in Example 1. In the same manner as in Example 1, the measurement results of the film thickness are shown in Table 2, and the measurement results of the resistance value (Ω) relative to the compressibility and the calculation results of the pinhole generation rate (%) after crushing are shown in Table 2. 5 in.
Embodiment 3
[0135] In the plating process of the (step b) of embodiment 1, the build-up bath solution is changed to the build-up bath solution shown in Table 1, and the supplementary solutions A and B not containing nickel are respectively changed to 800mL, in addition, All were carried out in the same manner as in Example 1. In the same manner as in Example 1, the measurement results of the film thickness are shown in Table 2, and the measurement results of the resistance value (Ω) relative to the compressibility and the calculation results of the pinhole generation rate (%) after crushing are shown in Table 2. 5 in.
PUM
| Property | Measurement | Unit |
|---|---|---|
| thickness | aaaaa | aaaaa |
| thickness | aaaaa | aaaaa |
| thickness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
Login to View More