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Nano-modified polyimide composite film and preparation method thereof

A polyimide and nano-modification technology, applied in the field of chemical materials, can solve the problems of low electrical breakdown resistance and high dielectric constant, achieve excellent dielectric properties, excellent electrical insulation, and improve product stability. sexual effect

Inactive Publication Date: 2013-07-31
广东道生科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The purpose of the present invention is to propose a nano-modified polyimide composite film and its preparation method, which overcomes the problems of low electrical breakdown resistance and high dielectric constant of existing PI materials, and has excellent heat resistance , electrical insulation, has excellent dielectric properties

Method used

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  • Nano-modified polyimide composite film and preparation method thereof
  • Nano-modified polyimide composite film and preparation method thereof

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Embodiment 1

[0026] A nano-modified polyimide composite film, the mass percent of various raw materials is: polyimide 72.5%, nano-modified powder 19.5%, coupling agent 8%.

Embodiment 2

[0028] A nano-modified polyimide composite film, the mass percent of various raw materials is: 60% of polyimide, 30% of nano-modified powder, and 10% of coupling agent.

Embodiment 3

[0030] A nano-modified polyimide composite film, the mass percent of various raw materials is: 85% of polyimide, 10% of nano-modified powder, and 5% of coupling agent.

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Abstract

The invention discloses a nano-modified polyimide composite film and a preparation method thereof. The nano-modified polyimide composite film comprises 60-85mass% of polyimide, 5-30mass% of nano-modified powder, and 5-10mass% of a coupling agent. Preparation methods of the nano-modified polyimide composite film mainly comprise a sol-gel method, an in-situ polymerization method, an intercalation method and the like, and the sol-gel method is adopted in the invention to prepare the nano-modified polyimide composite film. The nano-modified polyimide composite film has the advantages of excellent heat resistance, electric insulation property, and excellent dielectric performances.

Description

technical field [0001] The invention belongs to the technical field of chemical materials, and in particular relates to a nano-modified polyimide composite film and a preparation method thereof. Background technique [0002] Polyimide (PI) is a class of polymer materials containing imide rings in the main chain. Due to the characteristics of its own structure, it has particularly good heat resistance and excellent mechanical properties, electrical properties, electrical breakdown resistance, radiation resistance, solvent resistance, etc. The excellent performance at high temperature is comparable to that of some metals. In addition, it also has excellent chemical stability, toughness, wear resistance, flame retardancy, electrical insulation and other mechanical properties, and has been widely used in Aerospace, nuclear power and microelectronics fields. PI is widely used in the microelectronics industry as passivation and packaging materials for chip surfaces, α-particle s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L79/08C08K9/06C08K9/04C08K3/22C08K3/36C08K3/28C08K3/34C08K3/38C08K3/00C08K3/24C08G73/10C08J5/18
Inventor 李本立
Owner 广东道生科技股份有限公司
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