Ultra-precision Machining Method of Sapphire Substrate Based on Consolidated Abrasive Polishing Pad

A sapphire substrate, ultra-precision machining technology, applied in grinding tools, metal processing equipment, grinding devices, etc., can solve the problems of difficult to guarantee accuracy, large environmental pollution, low processing efficiency, etc., and achieve high processing efficiency and surface quality. High and high utilization effect
CN103252708BActive Publication Date: 2016-01-06NANJING UNIV OF AERONAUTICS & ASTRONAUTICS
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
NANJING UNIV OF AERONAUTICS & ASTRONAUTICS
Publication Date
2016-01-06

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Abstract

The invention discloses an ultra-precision processing method for a sapphire substrate based on a fixed abrasive polishing pad, which mainly includes three steps of rough grinding, fine grinding and polishing: first, a W75 nickel-plated diamond fixed abrasive grinding polishing pad ( FAP) to roughly grind the cut sapphire blank, secondly, use W28 nickel-plated diamond FAP to fine-grind the rough-grinded workpiece, and finally, use W5 diamond FAP to polish the fine-grinded workpiece, that is, to complete the grinding and polishing process. The invention processes the sapphire substrate, shortens the whole process to less than 2 hours, greatly shortens the processing time of sapphire, and finally can obtain the sapphire substrate with the workpiece surface roughness Ra less than 3nm, and can effectively remove pitting, scratches and other surface defects , and the subsurface damage is low, and the surface quality is excellent. The invention improves the processing efficiency and surface quality of the sapphire substrate, and has low cost and no pollution.
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Description

technical field

[0001] The present invention relates to an ultra-precision machining method for sapphire substrates, especially a method for processing sapphire substrates using a fixed abrasive polishing pad, specifically, a sapphire lining based on a fixed abrasive polishing pad The ultra-precision machining method of the bottom. Background technique

[0002] Sapphire has the characteristics of high hardness, high melting point, good light transmission, excellent thermal conductivity and electrical insulation, and stable chemical properties. It is widely used in national defense, aerospace, scientific research, industry, life and other fields, such as infrared light-transmitting materials , laser windows and mirrors, precision instruments, epitaxial substrates of semiconductor silicon, integrated chips of insulating substrates, etc. The surface quality of sapphire plays a key role in the quality, luminous efficiency and life of the device. Therefore, the processing requir...

Claims

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