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Copper foil layer-clad laminate and preparation method thereof

A technology of copper-clad laminates and manufacturing methods, which is applied in the field of copper-clad laminates, and can solve the problems of poor adhesion between laminates and copper foil, deterioration of product yield, and the influence of copper foil adhesion on processing procedures, etc.

Active Publication Date: 2013-09-11
KUANG CHI INST OF ADVANCED TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the lower the resin content of the prepreg, the worse the adhesion between the laminate and the copper foil after lamination
Copper foil adhesion will directly affect the metamaterial antenna etching process or the processing procedure of the metamaterial metal microstructure, and then lead to a serious deterioration in the overall product yield in the mass production process

Method used

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  • Copper foil layer-clad laminate and preparation method thereof
  • Copper foil layer-clad laminate and preparation method thereof
  • Copper foil layer-clad laminate and preparation method thereof

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Embodiment Construction

[0037] Reference will now be made in detail to the embodiments depicted in the accompanying drawings. In the following detailed description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, it will be understood by those skilled in the art that the present invention may be practiced without these specific details. In other instances, well-known methods are not described in detail. procedures, components and circuits so as not to unnecessarily obscure the embodiments.

[0038] see figure 1 , a schematic cross-sectional view of a copper-clad laminate of the present invention. The copper-clad laminate 13 includes a copper foil 20 and a mixed cured layer 2 formed by thermally pressing a plurality of prepregs. Copper foils 20 are attached to opposite sides of the mixed solidified layer. The mixed solidified layer 2 includes at least one first type solidified sheet 21 and second type solidified sheet 22 . T...

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Abstract

The invention discloses a copper foil layer-clad laminate. The copper foil layer-clad laminate comprises a mixed curing layer formed by hot-pressing a plurality of prepregs, and a copper foil attached to at least one side of the mixed curing layer, wherein the mixed curing layer comprises at least one first type of prepreg and one second type of prepreg, the first type of prepreg and the second type of prepreg comprise the glass fiber cloth and resin component, and the resin content in the second type of prepreg is less than that in the first type of prepreg. Through the overlaying and laminating of the first type of prepreg and the second type of prepreg, the resin content in the first type of prepreg is greater than that in the second type of prepreg. While maintaining that the resin content of the first type of prepreg is equal to that of the existing copper foil layer-clad laminate, the first type of prepreg and the copper foil are laminated on each other, and therefore, the dielectric constant of the whole copper foil layer-clad laminate is effectively improved without influencing the adhesion force between the copper foil and the laminate.

Description

technical field [0001] The invention relates to the field of copper-clad laminates, in particular to a copper-clad laminate with high copper foil adhesion and high dielectric constant and a preparation method thereof. Background technique [0002] Copper-clad laminates have been widely used in the field of PCB circuit boards, and their environmental operating frequency is relatively low-frequency. However, in the field of radio frequency, especially in the field of metamaterial antenna applications, copper-clad laminates are gradually widely used. Since the antenna is in the high-frequency band (compared to the existing PCB board) working environment, the copper-clad laminate Related parameters have a great influence on the performance of metamaterial antennas, such as its dielectric constant, dielectric loss value and other related parameters. In addition to the field of metamaterial antennas, copper clad laminates are also widely used in the field of metamaterials. For ex...

Claims

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Application Information

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IPC IPC(8): B32B15/08B32B15/20B32B37/00
Inventor 刘若鹏徐冠雄金曦胡侃王文剑
Owner KUANG CHI INST OF ADVANCED TECH
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