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Photosensitive resin composition

A technology of photosensitive resin and composition, which is applied in the field of photosensitive resin composition, can solve the problems of small height difference of resin pattern and failure to obtain resin pattern, etc., and achieve the effect of large height difference

Active Publication Date: 2013-09-11
SUMITOMO CHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] For the photosensitive resin composition proposed in the past, when resin patterns with different heights are simultaneously formed on the same substrate using a half-tone mask (Japanese original text of "half-tone mask"), the resulting The height difference of the resin pattern is small, and the resin pattern of the desired height may not be obtained

Method used

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  • Photosensitive resin composition
  • Photosensitive resin composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0202] Hereinafter, the present invention will be described in more detail by way of examples. Unless otherwise specified, "%" and "part" in an example are "mass%" and "mass part".

Synthetic example 1

[0204] In the flask equipped with reflux condenser, dropping funnel and stirrer, feed nitrogen at 0.02L / min to form a nitrogen atmosphere, add 200 parts by mass of 3-methoxy-1-butanol and 3-methoxybutyl acetic acid 105 parts by mass of the ester were heated to 70° C. while stirring. Next, 60 parts by mass of methacrylic acid, 3,4-epoxytricyclo[5.2.1.0 2.6 ] Decyl acrylate (the content ratio (molar ratio) of the compound shown in the compound shown in the formula (I-1) and the formula (II-1) is 50:50) 240 parts by mass are dissolved in 3-methoxybutyl A solution was prepared in 140 parts by mass of ethyl acetate, and this solution was dropped into a flask kept at 70° C. over 4 hours using a dropping funnel.

[0205]

[0206] On the other hand, 30 parts by mass of a polymerization initiator 2,2'-azobis(2,4-dimethylvaleronitrile) was dissolved in 225 parts by mass of 3-methoxybutyl acetate to prepare a solution , the solution was added dropwise to the flask using another drop...

Embodiment 1～7 and comparative example 1

[0218]

[0219] Each component shown in Table 1 was mixed in the ratio shown in Table 1 to obtain a photosensitive resin composition.

[0220] [Table 1]

[0221]

[0222] In addition, the content part of resin (A) in Table 1 shows the mass part of solid content conversion.

[0223] Resin (A): Resin Aa

[0224] Polymerizable compound (B): dipentaerythritol hexaacrylate (KAYARAD (registered trademark) DPHA; manufactured by Nippon Kayaku Co., Ltd.)

[0225] Polymerization initiator (C): Ca: N-acetoxy-1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]ethane-1-ylidene Amine (IRGACURE (registered trademark) OXE02; manufactured by BASF Corporation; O-acyl oxime compound)

[0226] Polymerization initiator (C): Cb: N-benzoyloxy-1-(4-phenylthiophenyl)octan-1-one-2-imine (IRGACURE (registered trademark) OXE01; BASF Corporation system; O-acyl oxime compound)

[0227] Polymerization initiator (C): Cc: 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butan-1-one (IRGACURE (registered...

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Abstract

A photosensitive resin composition containing (A), (B), (C), and (D) is disclosed, wherein (A) is a copolymer which contains a structure unit originated from at least one of an unsaturated carboxylic acid and an unsaturated carboxylic acid anhydride and a structure unit originated from monomer having a cyclic ether structure having 2 to 4 carbons and an olefinic bond type unsaturated key, (B) is a polymerized compound, (C) is a polymerization initiator which comprises an oxime compound of which the content is above 30 mass% and below 100 mass% of the total quantity of the polymerization initiator, and (D) is a compound shown by the formula (1). In the formula (1), R1 stands for an alkyl group having 1 to 6 carbons, and A1 to A4 respectively and independently signify hydrogen atoms or alkyl groups having 1 to 6 carbons.

Description

technical field [0001] The present invention relates to a photosensitive resin composition. Background technique [0002] In liquid crystal display devices in recent years, in order to form photo spacers (Japanese original text of "optical spacer": フオトスペーサ) or overcoat layers (Japanese original text of "outer coating layer": オババコト) and other resin patterns, using a photosensitive resin composition. As such a photosensitive resin composition, the composition which consists of resin, a polymeric compound, a polymerization initiator, and a solvent is known (JP2008-181087-A). [0003] For the photosensitive resin composition proposed in the past, when resin patterns with different heights are simultaneously formed on the same substrate using a half-tone mask (Japanese original text of "half-tone mask"), the resulting The height difference of the resin pattern is small, and the resin pattern of desired height may not be obtained. Contents of the invention [0004] The presen...

Claims

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Application Information

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IPC IPC(8): G03F7/027G03F7/004G03F7/00G02F1/1339
CPCG02F1/13G03F7/004G03F7/0045G03F7/028G03F7/20G03F7/202
Inventor 井上胜治
Owner SUMITOMO CHEM CO LTD
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