Fast-curing structural adhesive and preparation method thereof

A fast-curing, adhesive technology, applied in the direction of adhesives, non-polymer organic compound adhesives, etc., can solve the problems of poor moisture and heat aging resistance, large internal stress and large shrinkage rate of bonding parts.

Active Publication Date: 2013-09-18
塔威新材料科技(上海)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it has the disadvantages of poor moisture and heat aging resistance, large shrinkage rate, and large internal stress of the bonded parts, causing warpage and deformation.

Method used

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  • Fast-curing structural adhesive and preparation method thereof
  • Fast-curing structural adhesive and preparation method thereof
  • Fast-curing structural adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] Take 25Kg urethane acrylate and 15Kg N,N dimethylacrylamide into the stirring tank and stir for 10-30 minutes until the mixture is uniform; after adding 2Kg 2,4,6-trimethylbenzoyl-diphenylphosphine oxide , heat up to 40°C, stir at high speed for 30-60 minutes until 2,4,6-trimethylbenzoyl-diphenylphosphine oxide is completely dissolved; then add 35.5Kg E-51 epoxy resin, 1Kg barbiturate in sequence Acid, 0.5Kg silane coupling agent and stir for 10-30 minutes until uniform, control the stirring temperature not to exceed 50°C; cool down to below 25°C, add 18Kg polythiol, stir at high speed for 30-60 minutes, disperse evenly, control the temperature during stirring The temperature does not exceed 25°C; add 3Kg of fumed silica and other fillers, stir at high speed for 15-30 minutes, control the stirring temperature not higher than 25°C, vacuumize to remove air bubbles, and control the temperature not to exceed 25°C to obtain the finished product A, packed in cans , The storag...

Embodiment 2

[0028] Add 10Kg of polyether acrylate and 30Kg of isobornyl (meth)acrylate into a stirring tank and stir for 10-30 minutes until they are evenly mixed; after adding 5Kg of benzophenone and substituted benzophenone, heat up to 30°C, Stir at high speed for 30-60 minutes until the benzophenone and substituted benzophenone are completely dissolved; then add 50.9KgE-44 epoxy resin, 0.5Kg barbituric acid, 0.1Kg epoxy resin system stabilizer and stir for 10- 30 minutes until uniform, control the stirring temperature not to exceed 50°C; cool down to below 25°C, add 2.5Kg boron trifluoride amine, stir at high speed for 30-60 minutes, disperse evenly, control the temperature during stirring to not exceed 25°C; add 1Kg Calcium carbonate and other fillers, stirred at high speed for 15-30 minutes, controlled stirring temperature not higher than 25°C, vacuumed to remove air bubbles, controlled temperature not exceeding 25°C, to obtain finished product B, canned, and the storage temperature o...

Embodiment 3

[0030] Take 40Kg of polyester acrylate and 5Kg of tetrahydrofuryl (meth)acrylate into the stirring tank and stir for 10-30 minutes until the mixture is uniform; Minutes until diethoxyacetophenone is completely dissolved; then add 36KgE-20 epoxy resin, 5Kg barbituric acid, 2Kg curing accelerator and stir for 10-30 minutes until uniform, control the stirring temperature not to exceed 50 °C; cool down to Below 25 degrees Celsius, add 2Kg of dimethylimidazole propylene oxide butyl ether adduct, stir at high speed for 30-60 minutes, disperse evenly, control the temperature during the stirring process not to exceed 25°C; add 5Kg of nano-alumina and other fillers, stir at high speed 15-30 minutes, control the stirring temperature not to be higher than 25°C, vacuumize to remove air bubbles, control the temperature not to exceed 25°C, and obtain the finished product C, which can be packed, and the storage temperature of the finished product should not be higher than 5°C.

[0031] Table...

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PUM

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Abstract

The invention discloses a fast-curing structural adhesive comprising the following components: 20-60 parts of epoxy resin, 10-40 parts of acrylic resin, 5-30 parts of acrylate monomers, 2-30 parts of a latent epoxy resin curing agent, 0.5-5 parts of an one-component epoxy stabilizer, 2-5 parts of an acrylate photoinitiator, 1-20 parts of fillers, and 0.1-2 parts of an auxiliary agent. The invention further discloses a preparation method of the fast-curing structural adhesive. The fast-curing structural adhesive prepared according to the components and the preparation method effectively solves defects and insufficiencies of long positioning time and fully cured time, and poor resistance to heat aging properties.

Description

technical field [0001] The invention relates to the technical field of adhesives, in particular to a fast-curing structural adhesive. At the same time, the invention also discloses a preparation method of the adhesive. Background technique [0002] Epoxy resin adhesives have many advantages such as high bonding strength to metal substrates, low shrinkage, excellent aging resistance, and excellent electrical properties. They are widely used in aerospace, automotive, electronics, machinery and other fields, but epoxy resin adhesives are also There are some disadvantages, such as: slow curing speed, long positioning time, low bonding strength to plastic substrates. Among them, the one-component epoxy resin adhesive needs to be heated to at least 80°C to be cured, and the fast-curing two-component epoxy resin adhesive also needs at least about 10 minutes to be positioned. These defects and deficiencies have seriously affected the application of epoxy resin adhesives in fast-pac...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J4/02C09J4/06
Inventor 柳成良林江滨范建军
Owner 塔威新材料科技(上海)有限公司
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