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Low temperature sintered Ni metal fiber composite ceramic substrate

A technology of composite ceramics and metal fibers, applied in the field of metal fiber composite ceramic substrates, can solve the problems of low thermal conductivity and large thermal expansion coefficient of metal substrates, and achieve the effects of reducing sintering temperature, reducing preparation cost and improving thermal conductivity

Active Publication Date: 2013-10-02
SHANTOU UNIV
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  • Abstract
  • Description
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  • Application Information

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Problems solved by technology

[0004] The invention is aimed at the problem of relatively low thermal conductivity of ceramic substrates and large thermal expansion coefficient of metal substrates. Through the bridging heat conduction of metal fibers, the thermal conductivity of metal fibers / low-temperature sintered ceramic matrix composite substrates is greatly improved, which is convenient and efficient. Preparation of Ni metal fiber composite ceramic substrates to meet the high thermal conductivity requirements of high-power LEDs and high-integration high-power module circuits

Method used

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  • Low temperature sintered Ni metal fiber composite ceramic substrate

Examples

Experimental program
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Effect test

Embodiment 1

[0032] see figure 2 flow chart. Will Al 2 o 3 400g of powder, 200g of Ni metal fiber with a diameter of 1μm and an aspect ratio of 30~35, 370g of Al-Mg-Si glass additive, 30g of cerium oxide rare earth additive, and ball milling for 12 hours. After adding 50 g of water and 50 g of polyethylene glycol to the resulting mixture, mix it, let it stand for 15 minutes, and place it in a graphite mould. Send the graphite mold into the hot-press sintering equipment, pressurize in stages, dry at 120°C for 0.5 hours, raise the temperature to 600°C for heating and debinding, and keep for 0.5 hours. At a temperature of 1200°C and a pressure of 100 MPa, pressurize for 2 hours to obtain Ni / Al with uniform distribution of Ni metal fibers 2 o 3 Composite ceramic material matrix. The low-melting point insulating glass powder is made into slurry, and a thin layer of insulating glass slurry is evenly coated on the surface of the sintered composite ceramic material by spraying, and sintere...

Embodiment 2

[0034] Mix 350g of SiC ceramic powder, 280g of Ni metal fibers with a diameter of 5μm and an aspect ratio of 15-25, and 370g of Ca-Al-Si series low-temperature sintered glass additives, and mix them by ball milling for 12 hours. After adding 50 g of water and 50 g of polyethylene glycol to the resulting mixture, mix it, let it stand for 15 minutes, and place it in a graphite mould. Send the graphite mold into the hot-press sintering equipment, pressurize in stages, dry at 120°C for 1 hour, heat up to 600°C for heating and debinding, and keep for 0.5 hours. At a temperature of 1150° C. and a pressure of 120 MPa, the pressure is applied for 2 hours to obtain a composite ceramic material matrix uniformly distributed with Ni metal fibers. The low-melting point insulating glass powder is made into slurry, and a thin layer of insulating glass slurry is sprayed on the surface of the sintered composite ceramic material matrix, and sintered at 650°C for 1 hour to obtain a low-temperatu...

Embodiment 3

[0036] Si 3 N 4 350g of ceramic powder, 325g of Ni metal fibers with a diameter of 10μm and an aspect ratio of 16~18, 300g of Ca-Al-B-Si series low-temperature sintered glass additives, and 25g of yttrium oxide rare earth additives were ball milled and mixed for 12 hours. After adding 50 g of water and 50 g of polyethylene glycol to the resulting mixture, mix it, let it stand for 15 minutes, and place it in a graphite mould. Send the graphite mold into the hot-press sintering equipment, pressurize in stages, dry at 120°C for 0.6 hours, raise the temperature to 600°C for heating and debinding, and keep for 0.5 hours. At a temperature of 1100° C. and a pressure of 150 MPa, the pressure is applied for 2 hours to obtain a composite ceramic material matrix uniformly distributed with Ni metal fibers. The low-melting point insulating glass powder is made into a paste, and a thin layer of insulating glass paste is coated on the surface of the sintered composite ceramic material subs...

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Abstract

The invention provides a low temperature sintered Ni metal fiber composite ceramic substrate. The Ni metal fiber composite ceramic substrate comprises a Ni metal fiber composite ceramic material matrix and an insulated glass layer coated on the composite ceramic material matrix, wherein the sintering temperature of the Ni metal fiber composite ceramic matrix is below 1200 DEG C, and the Ni metal fiber composite ceramic matrix comprises 30-40 parts of ceramic powder body, 20-40 parts of metal fiber, and 30-40 parts of low temperature sintered glass additive. The invention also provides a preparation method for the substrate, which comprises the following steps of 1) mixing materials; 2) setting a die; 3) sintering; and 4) insulating and encapsulating. Due to the addition of a certain amount of low temperate sintered glass additive, the composite material can be sintered at low temperature below the Ni metal fiber melting point; as different ceramic powder bodies capable of realizing low temperature sintering are selected as main raw materials, the property and cost of the substrate can be conveniently regulated; high thermal conductive Ni metal fiber is added into the ceramic matrix, so that the Ni metal fiber can be interspersed in the ceramic matrix so as to form a heat conduction passage to improve the thermal conducting property of the substrate effectively.

Description

technical field [0001] The invention belongs to the field of LED substrates, in particular to metal fiber composite ceramic substrates. Background technique [0002] Ceramic materials have stable chemical properties, good electrical insulation, and a linear expansion coefficient very similar to that of electronic components. They are one of the commonly used substrate materials in electronic components. Moreover, the price of ceramic materials is relatively low, and they are widely used in the current electronics industry. Low-temperature sintered ceramics can sinter electrode materials, substrates, electronic devices, etc. at one time according to a preset structure, and can be used to realize high-integration, high-performance electronic packaging technology. However, the thermal conductivity of low-temperature sintered ceramics is relatively low, and it is difficult to meet the heat dissipation requirements of high-power integrated circuits or high-power LEDs. [0003] ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B35/76C04B35/63
Inventor 王双喜刘高山叶家星晏建宇
Owner SHANTOU UNIV
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