Phase-change thermal interface material and preparation method thereof

Abstract

The invention discloses a phase-change thermal interface material and a preparation method thereof. The phase-change thermal interface material mainly comprises phase-change resin, one or more of heat-conducting powder, a cross-linking agent, a polymerization initiator and a coupling agent. The preparation method of the phase-change thermal interface material comprises the following steps of: adding the polymerization initiator to the phase-change resin, and initially polymerizing the phase-change resin through light polymerization or thermal polymerization; then adding the coupling agent, uniformly mixing, then adding the heat-conducting powder for multiple times, and then fast stirring to promote the combination of the coupling agent and the heat-conducting powder; after mixing for certain time, adding the cross-linking agent and supplementing the polymerization initiator to obtain the phase-change thermal interface material. According to the invention, a polymer generates a certain degree of cross-linking; the phase-change thermal interface material disclosed by the invention has the advantage that a heat-conducting fin can not generate phase separation under the condition without influencing phase-change property when being increased in temperature in such a way that the cross-linking degree of the polymer is controlled.

Description

technical field

[0001] The invention belongs to the field of functional polymer materials, and in particular relates to a phase change thermal interface material and a preparation method thereof. Background technique

[0002] Electronic equipment generates heat when it is in use, especially the chip part, which generates a lot of heat, and a thermal interface material with high thermal conductivity is often used between the heating device and the heat sink to conduct heat to eliminate the heat caused by poor air heat transfer accumulation.

[0003] Common thermal interface materials include heat conduction sheets, heat dissipation paste, and phase change materials; heat conduction sheets are solid and easy to use, but when the thermal conductivity reaches above 3.0w / m.K, the hardness increases significantly, and it is difficult to ideally eliminate the interface between void. The heat dissipation paste is viscous paste. Even high-performance heat dissipation paste can stil...

Examples

Embodiment 1

[0021] Take 100 parts of decyl methacrylate and 0.25 parts of photoinitiator TPO, mix evenly, polymerize under a 100W ultraviolet lamp for 30 minutes to obtain polydecyl methacrylate with a viscosity of 1000-1300cps, and then add 1.2 parts of three Isopropyl stearate titanate, after stirring in a planetary mixer for 30 minutes, add 600 parts of spherical aluminum powder with a particle size of 3 microns three times, after stirring for 2 hours, add 1,6-hexanediol diacrylate dropwise 0.12 parts, photoinitiator TPO 0.25 parts. Vacuum was applied and stirring was continued for 30 minutes. After preheating, calendering and curing, a partially cross-linked phase change thermal interface material with a thermal conductivity of 5.2 W / m.K and a phase change temperature of 42-45° C. is obtained.

[0022] Paste the phase-change thermal interface material with a thickness of 0.25mm on a vertically placed aluminum plate at room temperature, and put it in a high and low temperature test bo...

Embodiment 2

[0024] Remove 100 parts of pentadecyl acrylate, 0.5 parts of thermal initiator lauroyl peroxide, mix well and heat to 120°C, after 30 minutes to obtain polypentadecyl acrylate with a viscosity of 1500cps to 1800cps, then cool down to room temperature, Add 2 parts of octyltrimethoxysilane, stir in a planetary mixer for 30 minutes, add 500 parts of aluminum nitride with a particle size of 2 microns three times, and after stirring for 3 hours, drop 1,6-hexanediol diacrylate 0.5 part, 0.5 part of lauroyl peroxide, vacuumize, and continue to stir for 30 minutes. After preheating, calendering, and curing, a partially cross-linked phase-change thermal interface material with a thermal conductivity of 4.0 W / m.K and a phase transition temperature of 47-51° C. is obtained.

[0025] Paste the phase-change thermal interface material with a thickness of 0.25mm on a vertically placed aluminum plate at room temperature, put it in a high and low temperature test box at -50-60°C, and undergo a...

technical field

[0001] The invention belongs to the field of functional polymer materials, and in particular relates to a phase change thermal interface material and a preparation method thereof. Background technique

[0002] Electronic equipment generates heat when it is in use, especially the chip part, which generates a lot of heat, and a thermal interface material with high thermal conductivity is often used between the heating device and the heat sink to conduct heat to eliminate the heat caused by poor air heat transfer accumulation.

[0003] Common thermal interface materials include heat conduction sheets, heat dissipation paste, and phase change materials; heat conduction sheets are solid and easy to use, but when the thermal conductivity reaches above 3.0w / m.K, the hardness increases significantly, and it is difficult to ideally eliminate the interface between void. The heat dissipation paste is viscous paste. Even high-performance heat dissipation paste can stil...

Examples

Embodiment 1

[0021] Take 100 parts of decyl methacrylate and 0.25 parts of photoinitiator TPO, mix evenly, polymerize under a 100W ultraviolet lamp for 30 minutes to obtain polydecyl methacrylate with a viscosity of 1000-1300cps, and then add 1.2 parts of three Isopropyl stearate titanate, after stirring in a planetary mixer for 30 minutes, add 600 parts of spherical aluminum powder with a particle size of 3 microns three times, after stirring for 2 hours, add 1,6-hexanediol diacrylate dropwise 0.12 parts, photoinitiator TPO 0.25 parts. Vacuum was applied and stirring was continued for 30 minutes. After preheating, calendering and curing, a partially cross-linked phase change thermal interface material with a thermal conductivity of 5.2 W / m.K and a phase change temperature of 42-45° C. is obtained.

[0022] Paste the phase-change thermal interface material with a thickness of 0.25mm on a vertically placed aluminum plate at room temperature, and put it in a high and low temperature test bo...

Embodiment 2

[0024] Remove 100 parts of pentadecyl acrylate, 0.5 parts of thermal initiator lauroyl peroxide, mix well and heat to 120°C, after 30 minutes to obtain polypentadecyl acrylate with a viscosity of 1500cps to 1800cps, then cool down to room temperature, Add 2 parts of octyltrimethoxysilane, stir in a planetary mixer for 30 minutes, add 500 parts of aluminum nitride with a particle size of 2 microns three times, and after stirring for 3 hours, drop 1,6-hexanediol diacrylate 0.5 part, 0.5 part of lauroyl peroxide, vacuumize, and continue to stir for 30 minutes. After preheating, calendering, and curing, a partially cross-linked phase-change thermal interface material with a thermal conductivity of 4.0 W / m.K and a phase transition temperature of 47-51° C. is obtained.

[0025] Paste the phase-change thermal interface material with a thickness of 0.25mm on a vertically placed aluminum plate at room temperature, put it in a high and low temperature test box at -50-60°C, and undergo a...