Epoxidized modified methylphenyl silicone resin for LED (Light Emitting Diode) packaging adhesive and preparation method thereof

A methyl phenyl silicon, LED packaging technology, applied in adhesives, electrical components, circuits, etc., can solve the problems of low light transmittance, low refractive index, poor compatibility of epoxy resin, and achieve simple and easy preparation process operation. Control, low impurity content, high cohesive effect
CN108384010AInactive Publication Date: 2018-08-10SOUTH CHINA UNIV OF TECH
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
SOUTH CHINA UNIV OF TECH
Publication Date
2018-08-10
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention belongs to the technical field of preparation of organic silicon modified epoxy resin and in particular relates to epoxidized modified methylphenyl silicone resin for an LED (Light Emitting Diode) packaging adhesive and a preparation method thereof. According to the method provided by the invention, 3-glycidoxypropyldimethoxymethylsilane and dimethoxymethylphenylsilane are used as raw materials and are subjected to hydrolytic condensation reaction to synthesize the epoxidized modified methylphenyl silicone resin. A preparation technology is simple to operate and easy to control and has good repeatability and controllability; an organic solvent is not needed so that the preparation technology is green and environmentally friendly. The epoxidized modified methylphenyl siliconeresin prepared by the method has low impurity content and no phase splitting phenomenon, and has the characteristics of high light transmittance, high refractive index, high thermal stability, high binding performance and the like of organic silicon resin and epoxy resin; large-scale production is extremely easy to realize in industry.
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Description

technical field

[0001] The invention belongs to the technical field of preparation of organosilicon-modified epoxy resins, and in particular relates to an epoxidation-modified methylphenyl silicone resin for LED packaging glue and a preparation method thereof. Background technique

[0002] Light-emitting diodes (LEDs) have a series of advantages such as stable performance, energy saving and high efficiency, safety and environmental protection, and are widely used in daily lighting, automotive lighting, mobile phones and televisions, and have become the trend and trend of future lighting technology. Encapsulation materials play an important role in improving the light output efficiency of LED lamps and prolonging their service life, so the selection of encapsulation materials is very important to the performance of LEDs. At present, the two mainstream materials used for LED packaging in the market are epoxy resin and silicone resin. Among them, in the past few decades, epoxy...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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