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Epoxidized modified methylphenyl silicone resin for LED (Light Emitting Diode) packaging adhesive and preparation method thereof

A methyl phenyl silicon, LED packaging technology, applied in adhesives, electrical components, circuits, etc., can solve the problems of low light transmittance, low refractive index, poor compatibility of epoxy resin, and achieve simple and easy preparation process operation. Control, low impurity content, high cohesive effect

Inactive Publication Date: 2018-08-10
SOUTH CHINA UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this simple physical blending makes the compatibility of silicone resin and epoxy resin poor, showing a multi-phase separation structure, so the prepared silicone epoxy resin still shows low light transmittance and low refractive index of epoxy resin. Disadvantages such as low and poor heat resistance

Method used

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  • Epoxidized modified methylphenyl silicone resin for LED (Light Emitting Diode) packaging adhesive and preparation method thereof
  • Epoxidized modified methylphenyl silicone resin for LED (Light Emitting Diode) packaging adhesive and preparation method thereof
  • Epoxidized modified methylphenyl silicone resin for LED (Light Emitting Diode) packaging adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] Preparation of epoxidized modified methylphenyl silicone resin:

[0029] (1) Preparation of Epoxidized Modified Methylphenyl Silicone Resin Crude Product

[0030] 22g of 3-glycidyl etheroxypropylmethyldimethoxysilane and 54.7g of methylphenyldimethoxysilane were mixed in a beaker and stirred evenly, and poured into a constant pressure dropping funnel as reactants. Take 76.7g of distilled water and 1.68g of barium hydroxide monohydrate and place them in a 250ml four-necked flask to prepare a mixture, stir and heat the mixture, and start to add the reactants dropwise when the temperature rises to 60°C, and control the reaction temperature to be 85°C. After the reactants were dropped, they were reacted at 85° C. for 4 h, and then the catalyst was removed by suction filtration under reduced pressure to obtain a crude product of epoxidized modified methylphenyl silicone resin.

[0031] (2) Refined epoxidized modified methylphenyl silicone resin

[0032] Wash the crude prod...

Embodiment 2

[0034] Preparation of epoxidized modified methylphenyl silicone resin:

[0035] (1) Preparation of Epoxidized Modified Methylphenyl Silicone Resin Crude Product

[0036] 22g of 3-glycidyl etheroxypropylmethyldimethoxysilane and 54.7g of methylphenyldimethoxysilane were mixed in a beaker and stirred evenly, and poured into a constant pressure dropping funnel as reactants. Take 86.4g of distilled water and 1.68g of barium hydroxide monohydrate and place them in a 250ml four-necked flask to prepare a mixture. Stir and heat the mixture. When the temperature rises to 60°C, start to add the reactants dropwise, and control the reaction temperature to 70°C. After the reactants were dropped, they were reacted at 70° C. for 4 h, and then the catalyst was removed by suction filtration under reduced pressure to obtain a crude product of epoxidized modified methylphenyl silicone resin.

[0037] (2) Refined epoxidized modified methylphenyl silicone resin

[0038] Wash the crude product of...

Embodiment 3

[0040] Preparation of epoxidized modified methylphenyl silicone resin:

[0041] (1) Preparation of Epoxidized Modified Methylphenyl Silicone Resin Crude Product

[0042] 22g of 3-glycidyl etheroxypropylmethyldimethoxysilane and 54.7g of methylphenyldimethoxysilane were mixed in a beaker and stirred evenly, and poured into a constant pressure dropping funnel as reactants. Take 86.4g of distilled water and 3.36g of barium hydroxide monohydrate and place them in a 250ml four-neck flask to prepare a mixture. Stir and heat the mixture. When the temperature rises to 60°C, start to add the reactants dropwise, and control the reaction temperature to 85°C. After the reactants were dropped, they were reacted at 85° C. for 4 h, and then the catalyst was removed by suction filtration under reduced pressure to obtain a crude product of epoxidized modified methylphenyl silicone resin.

[0043](2) Refined epoxidized modified methylphenyl silicone resin

[0044] Wash the crude product of ep...

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Abstract

The invention belongs to the technical field of preparation of organic silicon modified epoxy resin and in particular relates to epoxidized modified methylphenyl silicone resin for an LED (Light Emitting Diode) packaging adhesive and a preparation method thereof. According to the method provided by the invention, 3-glycidoxypropyldimethoxymethylsilane and dimethoxymethylphenylsilane are used as raw materials and are subjected to hydrolytic condensation reaction to synthesize the epoxidized modified methylphenyl silicone resin. A preparation technology is simple to operate and easy to control and has good repeatability and controllability; an organic solvent is not needed so that the preparation technology is green and environmentally friendly. The epoxidized modified methylphenyl siliconeresin prepared by the method has low impurity content and no phase splitting phenomenon, and has the characteristics of high light transmittance, high refractive index, high thermal stability, high binding performance and the like of organic silicon resin and epoxy resin; large-scale production is extremely easy to realize in industry.

Description

technical field [0001] The invention belongs to the technical field of preparation of organosilicon-modified epoxy resins, and in particular relates to an epoxidation-modified methylphenyl silicone resin for LED packaging glue and a preparation method thereof. Background technique [0002] Light-emitting diodes (LEDs) have a series of advantages such as stable performance, energy saving and high efficiency, safety and environmental protection, and are widely used in daily lighting, automotive lighting, mobile phones and televisions, and have become the trend and trend of future lighting technology. Encapsulation materials play an important role in improving the light output efficiency of LED lamps and prolonging their service life, so the selection of encapsulation materials is very important to the performance of LEDs. At present, the two mainstream materials used for LED packaging in the market are epoxy resin and silicone resin. Among them, in the past few decades, epoxy...

Claims

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Application Information

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IPC IPC(8): C08G77/14C08G77/34C09J183/06H01L33/56
CPCC08G77/14C08G77/34C09J183/06H01L33/56H01L2933/005
Inventor 潘朝群朱双丽
Owner SOUTH CHINA UNIV OF TECH
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