A patterned ceramic layer printed circuit substrate for optical and electronic devices

Abstract

The invention relates to a patterned ceramic layer printed circuit substrate for optical and electronic devices. The patterned ceramic layer printed circuit substrate comprises a metal substrate, wherein a voltage-withstanding ceramic layer is formed on the metal substrate; on the voltage-withstanding ceramic layer, by using a PVD (physical vapor deposition) method, a patterned high heat-conducting ceramic layer is deposited through a baffle plate, and multiple heat-conducting isolation bases are formed; and a metal circuit layer is formed on every heat-conducting isolation base. The patterned ceramic layer printed circuit substrate for optical and electronic devices has a metal substrate in a relatively large size, can accommodate multiple optical and / or electronic devices, and is provided with good electrical isolation and thermal isolation between the multiple optical and / or electronic devices.

Description

technical field

[0001] The invention belongs to the field of electronic technology, and more specifically, the invention relates to a patterned ceramic layer printed circuit substrate for optical and electronic devices. Background technique

[0002] Devices used in optics and / or electronics, such as integrated circuits or laser diodes, require the use of thermally conductive materials for heat transfer. For this purpose, a metallic base body is used, for example a copper base body, and an electrical isolation is often required between the optical and / or electronic components and the metal base body. And some ceramic materials have higher heat transfer efficiency and are electrically insulating. For this purpose, highly thermally conductive ceramic materials are frequently used as intermediate materials for providing electrical isolation while still maintaining thermal conductivity between the optical and / or electronic components and the metal base body. In order to provide...

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