Aluminum silicon carbide composite material with laser welding layer and its preparation method

Abstract

The invention discloses an aluminum silicon carbide composite material with a laser welding layer and a preparation method thereof. The composite material is composed of a laser welding layer and an aluminum silicon carbide layer. The laser welding layer is composed of pure aluminum or aluminum alloy, and the aluminum alloy contains silicon and aluminum, assuming that the volume fractions of silicon and aluminum in the aluminum alloy are a and b respectively, then 0<a≤30%, 30%≤b<100%; the aluminum silicon carbide layer is composed of silicon carbide and pure aluminum or aluminum alloy, Among them, the volume fraction of silicon carbide is 30% to 70%. The preparation method is to firstly prepare silicon carbide granulated powder, then prepare silicon carbide prefabricated parts, and finally adopt a vacuum pressure impregnation method to prepare aluminum silicon carbide composite materials with laser welding layers. The composite material of the invention has good weldability, high air tightness and thermal conductivity, low thermal expansion coefficient, and the preparation method is simple, efficient and low in cost.

Description

technical field [0001] The invention relates to an electronic packaging material used in the electronic information industry, in particular to an aluminum silicon carbide composite material with a laser welding layer that can be welded by laser and a preparation method thereof. Background technique [0002] With the development of the electronic information industry, the integration of chips continues to increase, which makes the operating temperature of the circuit continue to rise. Correspondingly, the requirements for packaging materials are becoming more and more stringent. Not only the packaging materials are required to have higher thermal conductivity, but also the Matching low thermal expansion coefficient, and in order to meet the needs of lightweight, it is also required that the density of the packaging material is as low as possible and the modulus of elasticity is as high as possible. Traditional packaging materials such as metal aluminum, copper, Kovar, tungste...

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Problems solved by technology

The shell can be laser welded to the Kovar cover plate, but the airtightness of the weld is difficult to meet the requirements, and the production process cost is also high

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