Improvement method for crystal rod cutting

Abstract

The invention relates to an improvement method for crystal rod cutting, which belongs to the technical field of photovoltaic processing. The improvement method of the crystal rod cutting adopts the technical scheme that a 1-2mm distance is reserved between crystal rods for adhering rods; resin strips are used for separately adhering the crystal rods; a line separation net device is mounted and hung on a machine outer wall; the line separation net is regulated to control the line net width within a range of 5-6 mm; a steel line is in the middle of a crevice of the separated line net and is repaired under a guide wheel with textured adhesive. The improvement method for the crystal rod cutting ensures that the reserved line net is larger than a crystal rod seam, and the generated benefits are superior to that in the prior part; the line separation net lowers head and tail sheet generated by the original cutting; qualified products are directly produced; the line separation net effectively reduces break of the line net because of the head and tail sheet; the line breaking rate is greatly lowered; the utilization rate of single-cutter equipment is improved; and the original cutting length 780 mm/cut is improved to 805 mm/cut.

Description

technical field [0001] The invention belongs to the technical field of photovoltaic processing, and in particular relates to an improved method for crystal bar cutting. Background technique [0002] With the rapid development of the photovoltaic industry and the competitive pressure of the international market, more and more silicon wafer cutting companies can only survive by reducing production costs and improving the high-quality rate of silicon wafer cutting to improve competitiveness. At present, silicon wafers of various companies The cutting process and operation process are roughly the same. How to achieve better benefits under the same process and process requires paying attention to details, making improvements in small operations, and minimizing losses in the production process. [0003] Crystal ingots are fixed on the cutting table, usually 4 pieces at a time, and the cutting table vertically passes through the moving cutting wire to cut the net, so that the ingot...

AI Technical Summary

Problems solved by technology

The cutting principle seems very simple, but there are many challenges in the actual operation process. The wire saw must precisely balance and control the cutting wire diameter, cutting speed and total cutting area, so as to obtain consistent silicon wafers without breaking the silicon wafers. Thickness, and shorten cutting time

At present, during the cutting process of silicon wafers, a large number of head and tail pieces will be produced at both ends of the crystal rod, so that the crystal rod has not been reasonably utilized