Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Laser cutting processing method and system of ceramic substrate

A ceramic substrate and laser cutting technology, which is applied in laser welding equipment, metal processing equipment, manufacturing tools, etc., can solve the problems of slag on the cracked surface, inapplicability, and jagged edges, etc., and achieve the improvement of yield rate and excellent solution The effect of the program

Active Publication Date: 2013-12-11
WUHAN DR LASER TECH CORP LTD
View PDF7 Cites 15 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, for the cutting of ceramic substrates with higher requirements, the cutting of ceramic circuit substrates for microelectronic applications, such as linear cutting of ceramic resistors and circuit unit shapes, is not applicable.
Ceramic substrates cut by high-power CO2 lasers have wide laser line widths and jagged edges, especially cracks at the intersection of cutting and a large amount of slag on the surface

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Laser cutting processing method and system of ceramic substrate
  • Laser cutting processing method and system of ceramic substrate
  • Laser cutting processing method and system of ceramic substrate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0023] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0024] The embodiment of the present invention takes figure 1 The schematic diagram of laser frequency recombination is used to illustrate the specific implementation. Its features include the use of pulsed lasers. By recombining the laser frequency, multiple laser pulses fall on the same point of the workpiece to achieve dot marking or dotted line marking on the ceramic substrate. Separation is carried out in a split mode; using the process method of the present invention, adjusting the number of pulses in a single hole can control the variation of the hole depth; the power of the laser used to complete the dot marking or dotted line marking process does not need to be too high, because multiple pulses can The hole depth is increased to achieve the effect of high...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
wavelengthaaaaaaaaaa
Login to View More

Abstract

The invention relates to a laser cutting processing method of a ceramic substrate. The laser cutting processing method comprises the following steps: using a pulse laser device, recombining the laser frequency to enable multiple laser pulses to be located at the same point of a machined workpiece, achieving doting scoring or imaginary line scoring on the ceramic substrate, and carrying out separation in a splintering mode at the later period. The invention further relates to a laser cutting system of the ceramic substrate workpiece. The laser cutting system comprises an X-axis displacement table, a Y-axis displacement table, a CCD camera, a feeding-discharging system, a workpiece suction disc, a locating system, a Z-axis displacement table and a laser focusing assembly, wherein the laser focusing assembly is arranged above the workpiece suction disc, the workpiece suction disc is connected with the Y-axis displacement table, the Z-axis displacement table is arranged above the workpiece suction disc and connected with the laser focusing assembly, the CCD camera is arranged below the workpiece suction disc, and the feeding-discharging system comprises a 90-degree supporting plate, a suction disc A, a suction disc B, a feeding box and a discharging box and is used for completing automatic feeding-discharging motions of the machined workpiece. Both the notch quality and the yield are greatly improved.

Description

technical field [0001] The invention relates to the field of laser cutting processing methods, in particular to a laser cutting processing method and system for ceramic substrates. Background technique [0002] The ceramic substrate has excellent electrical insulation properties, high thermal conductivity, excellent solderability and high adhesion strength, and can etch various patterns like a PCB board, and has a large current-carrying capacity. Ceramic substrates have become the basic materials for high-power power electronic circuit structure technology and interconnection technology. Widely used in aerospace and military electronic components, mobile communications, computers, household appliances and automotive electronics and other fields. [0003] Laser cutting technology has now become a mature industrial processing technology. In addition to the traditional metal as the main object of cutting, cutting technology such as ceramics as the cutting object has become an ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/36B23K26/42
Inventor 李志刚
Owner WUHAN DR LASER TECH CORP LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com