Laser cutting processing method and system of ceramic substrate

Abstract

The invention relates to a laser cutting processing method of a ceramic substrate. The laser cutting processing method comprises the following steps: using a pulse laser device, recombining the laser frequency to enable multiple laser pulses to be located at the same point of a machined workpiece, achieving doting scoring or imaginary line scoring on the ceramic substrate, and carrying out separation in a splintering mode at the later period. The invention further relates to a laser cutting system of the ceramic substrate workpiece. The laser cutting system comprises an X-axis displacement table, a Y-axis displacement table, a CCD camera, a feeding-discharging system, a workpiece suction disc, a locating system, a Z-axis displacement table and a laser focusing assembly, wherein the laser focusing assembly is arranged above the workpiece suction disc, the workpiece suction disc is connected with the Y-axis displacement table, the Z-axis displacement table is arranged above the workpiece suction disc and connected with the laser focusing assembly, the CCD camera is arranged below the workpiece suction disc, and the feeding-discharging system comprises a 90-degree supporting plate, a suction disc A, a suction disc B, a feeding box and a discharging box and is used for completing automatic feeding-discharging motions of the machined workpiece. Both the notch quality and the yield are greatly improved.

Description

technical field [0001] The invention relates to the field of laser cutting processing methods, in particular to a laser cutting processing method and system for ceramic substrates. Background technique [0002] The ceramic substrate has excellent electrical insulation properties, high thermal conductivity, excellent solderability and high adhesion strength, and can etch various patterns like a PCB board, and has a large current-carrying capacity. Ceramic substrates have become the basic materials for high-power power electronic circuit structure technology and interconnection technology. Widely used in aerospace and military electronic components, mobile communications, computers, household appliances and automotive electronics and other fields. [0003] Laser cutting technology has now become a mature industrial processing technology. In addition to the traditional metal as the main object of cutting, cutting technology such as ceramics as the cutting object has become an ...

AI Technical Summary

Problems solved by technology

However, for the cutting of ceramic substrates with higher requirements, the cutting of ceramic circuit substrates for microelectronic applications, such as linear cutting of ceramic resistors and circuit unit shapes, is not applicable.

Ceramic substrates cut by high-power CO2 lasers have wide laser line widths and jagged edges, especially cracks at the intersection of cutting and a large amount of slag on the surface

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