Heat-conducting electric insulation silicon rubber thermal interface material and preparation method thereof

A thermal interface material, silicone rubber technology, applied in the field of rubber nanocomposite materials, can solve the problem of low thermal conductivity and achieve the effect of improving thermal conductivity

Active Publication Date: 2013-12-11
BEIJING UNIV OF CHEM TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The purpose of the present invention is to solve the problem of low thermal conductivity of existing thermal interface materials at the i...

Method used

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  • Heat-conducting electric insulation silicon rubber thermal interface material and preparation method thereof

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Experimental program
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Effect test

Embodiment 1

[0036] Sodium lauryl sulfate is added to toluene to prepare a 20mg / ml solution, and then 1 part of graphene powder is added to the solution, wherein the graphene powder mass (g) is related to the volume of the surfactant toluene solution (ml ) with a ratio of 1:500, and then ultrasonically oscillated by a 900W ultrasonic cell breaker for 60 minutes to infiltrate the graphene surface with the active agent, and finally peel the graphene into a thinner sheet structure and uniformly disperse it to obtain graphite Graphene dispersion; 200 parts of spherical thermally conductive alumina fillers were added to the graphene dispersion, and stirred evenly to make a thermally conductive filler slurry for use. Dissolve 100 parts of raw liquid silicone rubber with a viscosity of 200000cs in n-hexane, mix it with the thermally conductive filler slurry, dry the mixed mixture at 100°C, and divide it into two parts of equal mass, A component and B component. Add 3 parts of hydrogen-containing ...

Embodiment 2

[0038]Sodium lauryl sulfate is added in toluene to prepare a 20mg / ml solution, and then 2 parts of graphene powder are added to the solution, wherein the graphene powder mass (g) is related to the volume of surfactant toluene solution (ml ) with a ratio of 1:500, and then ultrasonically oscillated by a 900W ultrasonic cell breaker for 60 minutes to infiltrate the graphene surface with the active agent, and finally peel the graphene into a thinner sheet structure and uniformly disperse it to obtain graphite Graphene dispersion; 200 parts of spherical thermally conductive alumina fillers were added to the graphene dispersion, and stirred evenly to make a thermally conductive filler slurry for use. Dissolve 100 parts of raw liquid silicone rubber with a viscosity of 200000cs in n-hexane, mix it with the thermally conductive filler slurry, dry the mixed mixture at 100°C, and divide it into two parts of equal mass, A component and B component. Add 3 parts of hydrogen-containing sil...

Embodiment 3

[0040] Sodium lauryl sulfate is added to toluene to prepare a 20mg / ml solution, and then 1 part of graphene powder is added to the solution, wherein the graphene powder mass (g) is related to the volume of the surfactant toluene solution (ml ) with a ratio of 1:500, and then ultrasonically oscillated by a 900W ultrasonic cell breaker for 60 minutes to infiltrate the graphene surface with the active agent, and finally peel the graphene into a thinner sheet structure and uniformly disperse it to obtain Graphene dispersion: 300 parts of spherical heat-conducting alumina fillers are added to the graphene dispersion, stirred evenly to make a heat-conducting filler slurry, and set aside. Dissolve 100 parts of raw liquid silicone rubber with a viscosity of 200000cs in n-hexane, mix it with the thermally conductive filler slurry, dry the mixed mixture at 100°C, and divide it into two parts of equal mass, A component and B component. Add 3 parts of hydrogen-containing silicone oil cros...

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Abstract

The invention discloses a heat-conducting electric insulation silicon rubber thermal interface material and a preparation method thereof and belongs to the technical field of rubber nanocomposite materials. The preparation method comprises the following steps: treating graphene by employing a surfactant, ultrasonically dispersing the graphene into a relatively thin and uniform nano sheet structure, compounding the graphene with spherical aluminum oxide, adding compounded packing into raw silicon rubber dissolved by normal hexane for uniformly mixing, drying, adding a cross-linking agent, a catalyst and a polymerization inhibitor, vulcanizing and performing compression molding to obtain the heat-conducting electric insulation silicon rubber thermal interface material. The graphene is subjected to the surface treatment and is ultrasonically dispersed into a relatively thin sheet structure, and the formation of a heat-conducting network is promoted; moreover, due to the addition of a small amount of treated graphene, the heat-conducting performance can be greatly improved, the influence on the hardness of a composite material is small, and the composite material can reach an insulating level by controlling the amount of the graphene, so that the heat-conducting electric insulation silicon rubber thermal interface material can be applied to electronic products.

Description

technical field [0001] The invention belongs to the technical field of rubber nanocomposite materials, and relates to a heat-conducting and electrically insulating silicone rubber thermal interface material and a preparation method thereof. Background technique [0002] As electronic products such as computer CPUs and smartphone processors tend to be miniaturized and high-performance, the heat dissipation of products has attracted much attention, and thermal interface materials play an important role in improving heat dissipation. Thermal interface materials are usually prepared by adding high thermal conductivity fillers to elastomer materials. Therefore, research on high thermal conductivity fillers has attracted attention. Alumina is a thermally conductive filler used in a large amount on the market. It is added to elastomers, and thermal interface materials can be prepared through surface modification and particle size and type compounding. However, the thermal conductiv...

Claims

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Application Information

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IPC IPC(8): C08L83/04C08K9/04C08K3/04C08K7/18
Inventor 卢咏来王孝波刘力张立群张继阳冯予星
Owner BEIJING UNIV OF CHEM TECH
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