Unlock instant, AI-driven research and patent intelligence for your innovation.

Polyimide thin film

A technology of polyimide film and polyamic acid, which is applied in the field of polyimide film with high strength, high modulus and high dimensional stability and its preparation, can solve the problems of high price, low reactivity, and low mechanical properties of the film, etc. problem, to achieve the effect of low price, improved strength and dimensional stability, and low cost

Inactive Publication Date: 2013-12-25
ZHUZHOU TIMES ELECTRIC INSULATION
View PDF2 Cites 7 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In recent years, some researchers have used fluorine-containing monomers to improve the overall performance of polyimide films for harsher environments, such as author R. H. Pater, literature SAMPE J., 30 (5), 29 (1994) disclosed Use 2,2-bis(3,4-dicarboxyphenyl) hexafluoropropane dianhydride to modify polyimide film to obtain commercialized LaCRTM series products, although the performance of polyimide film has been improved to a certain extent. Comprehensive performance, but this special monomer has low reactivity, low mechanical properties of the film, and expensive

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Polyimide thin film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] 1. Proportion

[0033] The weight and number ratio of polyamic acid precursor and N-methylpyrrolidone, triethylamine, acetic anhydride is 25:75:15:25;

[0034] Among them, the ratio of the polyamic acid precursor is: the molar ratio of pyromellitic dianhydride to 4,4'-diaminodiphenyl ether and bis(3 aminophenyl)acetylene is 1:0.8:0.2.

[0035] 2. Resin synthesis

[0036] At 60°C, dissolve the above polyamic acid precursor in N-methylpyrrolidone, heat up and react for 3 hours to generate polyamic acid, and finally cool to room temperature, add triethylamine and acetic anhydride and stir evenly to obtain a transparent polyamic acid solution.

[0037] 3. Imidization film formation

[0038] After defoaming the polyamic acid solution, it was cast onto a steel belt, heated at 170°C for 90 seconds to remove the solvent, and imidized at 250°C for 10 seconds, 400°C for 20 seconds, and 450°C for 12 seconds to obtain 25 μm polyimide film.

Embodiment 2

[0040] 1. Proportion

[0041] The weight ratio of polyamic acid precursor to N,N-dimethylformamide, triethylamine and acetic anhydride is 30:50:10:30;

[0042] Among them, the ratio of the polyamic acid precursor is: the molar ratio of biphenyl tetracarboxylic dianhydride to 3,4'-diaminodiphenyl ether and bis(3 aminophenyl)acetylene is 1:0.5:0.5.

[0043] 2. Resin synthesis

[0044] At 25°C, dissolve the above polyamic acid precursor in N,N-dimethylformamide, heat up and react for 3 hours to generate polyamic acid, and finally cool to room temperature, add triethylamine and acetic anhydride and stir Evenly, a transparent polyamic acid solution was obtained.

[0045] 3. Imidization film formation

[0046] After defoaming the polyamic acid solution, it was cast onto a steel belt, heated at 160°C for 120 seconds to remove the solvent, and imidized at 240°C for 13 seconds, 410°C for 18 seconds, and 450°C for 10 seconds to obtain 25 μm polyimide film.

Embodiment 3

[0048] 1. Proportion

[0049] The weight ratio of polyamic acid precursor to N,N-dimethylacetamide, pyridine and propionic anhydride is 30:50:20:15;

[0050] Among them, the ratio of the polyamic acid precursor is: the molar ratio of 4,4'-(hexafluoroisopropylene) diphthalic anhydride to 4,4'-diaminodiphenyl sulfide and bis(3 aminophenyl)acetylene is 1:0.9:0.1,

[0051] 2. Resin synthesis

[0052] Dissolve the above polyamic acid precursor in N,N-dimethylacetamide at 30°C, heat up and react for 3 hours to generate polyamic acid, and finally cool to room temperature, add pyridine and propionic anhydride and stir evenly, A transparent polyamic acid solution was obtained.

[0053] 3. Imidization film formation

[0054] After defoaming the polyamic acid solution, it was cast onto a steel belt, heated at 175°C for 70 seconds to remove the solvent, and imidized at 260°C for 8 seconds, 390°C for 25 seconds, and 440°C for 10 seconds to obtain 25 μm polyimide film.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a polyimide thin film. The thin film is prepared by heating and imidizing a resin solution composition which is mixed by a polar organic solvent, a polyamide acid precursor, a catalyst and a dehydrant according to a certain proportion, wherein meta-aromatic diamine containing alkynyl in a molecular chain is used in the prescription, alkynyl is subjected to a crosslinking reaction in high-temperature imidization, so that the strength and size stability of the polyimide thin film can be greatly improved; monomers added in the thin film are not high in price, so that the whole polyimide thin film is low in cost and has excellent heat endurance, chemical performance, electrical performance, chemical stability and radiation resistance, and can be widely applied to the fields of aviation, aerospace, micro-electronics, nanometers, liquid crystal, separating membranes, laser and the like.

Description

technical field [0001] The invention relates to a polyimide film and a preparation method thereof, in particular to a polyimide film with high strength, high modulus and high dimensional stability containing alkyne groups in the molecular main chain and a preparation method thereof. Background technique [0002] Polyimide film is currently a good film insulation product. Its molecular structure endows it with excellent heat resistance, mechanical properties, electrical properties, chemical stability and radiation resistance. It is widely used in aviation, aerospace, microelectronics , nanometer, liquid crystal, separation membrane, laser and other fields. [0003] At present, the traditional polyimide film is made of pyromellitic dianhydride (PMDA) and diaminodiphenyl ether (ODA) in a very strong solvent dimethylacetamide (DMAC) through polycondensation and salivation to form a film. Formed by imidization, due to the limitation of its molecular structure, the strength, modu...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): C08L79/08C08G73/10C08J5/18
Inventor 廖波张步峰田苗王文进周升
Owner ZHUZHOU TIMES ELECTRIC INSULATION