Toughening modification method for bismaleimide resin

A kind of bismaleimide resin, maleimide resin technology, applied in the direction of adhesive and so on

Inactive Publication Date: 2013-12-25
INST OF PETROCHEM HEILONGJIANG ACADEMY OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The present invention aims to solve the problem of improving the toughness of bismaleimide resin at the expense of other properties in existing methods for toughening bismaleimide resin, and provides a toughening method for bismaleimide resin. toughness modification method

Method used

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  • Toughening modification method for bismaleimide resin
  • Toughening modification method for bismaleimide resin
  • Toughening modification method for bismaleimide resin

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specific Embodiment approach 1

[0012] Specific embodiment one: the toughening modification method of bismaleimide resin of the present embodiment, carry out according to the following steps:

[0013] 1. Prepolymerization reaction: Stir diallyl bisphenol A, bismaleimide resin and vinyl-terminated nitrile rubber in an oil bath at a temperature of 120°C to 150°C until they are completely dissolved, and then at a temperature of 120°C ℃~150℃ under oil bath, continue to stir and react for 20min~40min to obtain prepolymer; the molar ratio of bismaleimide resin to diallyl bisphenol A is (0.9~1.9):1; The bismaleimide resin is 100phr, and the addition of the vinyl-terminated nitrile rubber is 5phr~15phr;

[0014] 2. Add silicon carbide whiskers treated with silane coupling agent to the prepolymer obtained in step 1. After stirring evenly, put it into a vacuum with a temperature of 120℃~130℃ and a vacuum degree of -0.09MPa~-0.1MPa. Perform defoaming treatment in a drying oven for 25-35 minutes, and then pour into a m...

specific Embodiment approach 2

[0020] Specific embodiment 2: The difference between this embodiment and specific embodiment 1 is that the bismaleimide resin described in step 1 is 4,4-diaminodiphenylmethane bismaleimide resin (BDM) and 4,4'-bis(3-maleimidophenoxy)benzophenone (EK-BMI) or a mixture of both. Others are the same as in the first embodiment.

[0021] When the bismaleimide resin described in this embodiment is a mixture, each component is mixed in any ratio.

specific Embodiment approach 3

[0022] Specific embodiment three: the difference between this embodiment and specific embodiment one or two is: the molar ratio of bismaleimide resin and diallyl bisphenol A described in step one is (1.0~1.8): 1. Others are the same as in the first or second embodiment.

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Abstract

The invention provides a toughening modification method for bismaleimide resin, and relates to the bismaleimide resin field, in particular to a method for toughening modification of bismaleimide by combining diallyl bisphenol A, vinyl-terminated nitrile butadiene rubber and SiC crystal whiskers. The toughening modification method aims to solve the problem that an existing method for toughening the bismaleimide resin enhances the toughness of the bismaleimide resin at the cost of sacrificing other properties. According to the toughening modification method, the diallyl bisphenol A, the vinyl-terminated nitrile butadiene rubber and the bismaleimide resin are subjected to copolymerization, and then silicon carbide crystal whiskers are added into the system for blending to obtain modified bismaleimide resin. The modified bismaleimide resin prepared through the toughening modification method can be used as matrix resin of a composite material or subject resin of an adhesive.

Description

technical field [0001] The invention relates to the field of bismaleimide resins, in particular to a method for toughening and modifying bismaleimide by combining diallyl bisphenol A, vinyl-terminated nitrile rubber and SiC whiskers. Background technique [0002] Bismaleimide (BMI) is a thermosetting resin with excellent heat resistance. It has good heat resistance, radiation resistance, humidity resistance, aging resistance and electrical insulation. Its application range is more and more extensive. However, the bismaleimide resin itself has a high melting point, poor solubility, and poor toughness of the cured product, and the unmodified bismaleimide resin has no practical application value. In recent years, research at home and abroad has mainly focused on toughening modification, and some research progress has been made so far. Simply using rubber (generally not participating in the system reaction) or inorganic particles to toughen bismaleimide resin is not ideal. The...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L79/08C08L15/00C08K9/06C08K7/10C08K3/34C08K5/13C09J179/08
Inventor 杨海冬曲春艳王德志毛勇王海民张杨
Owner INST OF PETROCHEM HEILONGJIANG ACADEMY OF SCI
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