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Treated copper foil with porous structure on surface and preparation method thereof

A porous structure and surface treatment technology, applied in the field of copper foil materials, can solve the problems of small specific surface area, difficult to meet higher product quality and performance, low bonding strength of resin substrates, etc., to increase specific surface area and controllable porous structure. and uniform, easy-to-control operating conditions

Active Publication Date: 2014-01-01
UNIV OF SCI & TECH BEIJING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

On this basis, develop a treated copper foil with a porous structure on the surface, develop a preparation method for the treated copper foil with a porous structure on the surface, and solve the problem of the small specific surface area of ​​the current surface-treated copper foil and the bonding strength between the resin substrate Low, the quality and performance of the product are difficult to meet the higher requirements for use, etc.

Method used

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  • Treated copper foil with porous structure on surface and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0018] The surface dealloying treatment of the surface-treated copper foil with the tin-zinc alloy layer as the anti-oxidation passivation layer is carried out by conventional chemical etching. Dilute 98% concentrated sulfuric acid to 1g / l, prepare a sulfuric acid solution, and prevent oxidation of the tin-zinc alloy under the conditions of an angle of 0° between the surface of the tin-zinc alloy anti-oxidation passivation layer and the surface of the sulfuric acid solution, and a temperature of 40°C. The surface layer of the passivation layer is dealloyed for 600s, and a porous layer with a submicron porous structure is prepared on the surface layer to obtain a treated copper foil with a submicron porous structure on the surface. Then wash with deionized water. On this basis, the KH-550 silane coupling agent was made into a dilute solution with a concentration of 1%, and a thin layer of silane coupling agent layer was sprayed on the surface of the porous layer of the treated ...

Embodiment 2

[0020] The surface dealloying treatment of the surface-treated copper foil with the tin-zinc alloy layer as the anti-oxidation passivation layer is carried out by conventional chemical etching. Dilute 98% concentrated sulfuric acid to 3g / l, prepare sulfuric acid solution, under the condition that the angle between the surface of the tin-zinc alloy anti-oxidation passivation layer and the surface of the sulfuric acid solution is 180°, and the temperature is 30°C, the oxidation resistance of the tin-zinc alloy The surface layer of the passivation layer is subjected to dealloying treatment for 800s, and a porous layer with a submicron porous structure is prepared on the surface layer to obtain a treated copper foil with a submicron porous structure on the surface. Then wash with deionized water. On this basis, the KH-550 silane coupling agent was made into a dilute solution with a concentration of 0.5%, and a thin layer of silane coupling agent layer was dipped and sprayed on the...

Embodiment 3

[0022] The surface dealloying treatment of the surface-treated copper foil with the tin-zinc alloy layer as the anti-oxidation passivation layer is carried out by conventional chemical etching. Dilute 98% concentrated sulfuric acid to 5g / l, prepare sulfuric acid solution, and prevent oxidation of tin-zinc alloy under the condition that the angle between the surface of the tin-zinc alloy anti-oxidation passivation layer and the surface of the sulfuric acid solution is 90° and the temperature is 20°C The surface layer of the passivation layer is subjected to dealloying treatment for 1200s, and a porous layer with a submicron porous structure is prepared on the surface layer to obtain a treated copper foil with a submicron porous structure on the surface.

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Abstract

Belonging to the field of copper foil materials, the invention relates to a treated copper foil with a porous structure on the surface and a preparation method thereof. The treated copper foil with a porous structure on the surface is characterized in that the surface layer of its anti-oxidation and passivation layer is a porous layer, and an organized layer can be dip sprayed on the surface of the treated copper foil; a chemical corrosion or electrochemical way is employed to conduct dealloying treatment on the anti-oxidation and passivation layer's surface layer of a traditional surface treated copper foil so as to obtain the treated copper foil with a porous layer on the surface, and after washing, the organized layer treatment can be carried out on the surface of the porous layer. The anti-oxidation and passivation layer's surface layer of the surface treated copper foil is a porous structure, thus greatly increasing the specific surface area, being in favor of enhancing the bonding strength between resin substrates, and speeding up application of the surface treated copper foil. The dealloying method is employed to prepare the porous structure-containing porous layer on the anti-oxidation and passivation layer's surface layer of the surface treated copper foil, and has the advantages of simple equipment, short flow, high efficiency, energy saving and consumption reduction, low cost, green and environmental protection.

Description

technical field [0001] The invention relates to the field of copper foil materials, and in particular provides a treated copper foil with a porous structure on the surface and a preparation method thereof. technical background [0002] Copper foil (including rolled copper foil and electrolytic copper foil) is one of the core basic materials for manufacturing printed circuit boards (Printed Circuit Board, PCB). With the rapid development of the electronic information industry, the use of copper foil is increasing, and the demand for high-performance copper foil is increasing day by day. In practical applications, the copper foil and the resin substrate are generally pressed into a copper clad laminate under high temperature and pressure conditions. In order to ensure sufficient bonding strength between the copper foil and the resin substrate, treated copper foil with a roughened surface is usually used in the production of printed circuit boards. [0003] Traditional copper...

Claims

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Application Information

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IPC IPC(8): B32B15/04B32B15/20C23F1/02C25F3/14
Inventor 刘雪峰王文静谢建新
Owner UNIV OF SCI & TECH BEIJING