Component manufacturing method and component

A manufacturing method and component technology, which are applied in the manufacturing of components and the component field, can solve the problems of mechanical properties and electrical properties reduction, hinder the thinning of mounting parts, etc., and achieve the effect of cost reduction

Active Publication Date: 2014-01-22
ULVAC INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the solder layer is thinned, there is a problem that the mechanical properties and electrical properties are lowered, which hinders the thinning of mounting parts and packages

Method used

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  • Component manufacturing method and component
  • Component manufacturing method and component
  • Component manufacturing method and component

Examples

Experimental program
Comparison scheme
Effect test

no. 1 approach ）

[0061] Figure 1A to Figure 1F It is a process sectional view explaining the manufacturing method of the component of this invention.

[0062] (step 1a)

[0063] First, if Figure 1A As shown, using a substrate 10 made of nickel (Ni) on one side 10a, an alloy film 11 containing silver (Ag), tin (Sn) and copper (Cu) is formed on one side 10a by sputtering. (Process A1).

[0064] As for the substrate 10 , one surface only needs to be formed of nickel. For example, a silicon (Si) substrate 10 formed with a nickel (Ni) film on one surface is suitably used. Hereinafter, a substrate having such a structure is also referred to as a Ni film-coated substrate 10 .

[0065] In particular, the present embodiment opposes the cathode electrode 60 (see image 3 ) and anode electrode 70 (see image 3 ), when the alloy film 11 is formed on one side of the substrate 10, a DC pulse voltage is applied to the cathode electrode 60, wherein the cathode electrode 60 is provided with silver (Ag)...

no. 2 approach

[0129] Next, a second embodiment of the present invention will be described.

[0130] In addition, in the following description, the part which differs from the said 1st Embodiment is mainly demonstrated, and the description of the part which is the same as the 1st Embodiment may be abbreviate|omitted.

[0131] Figure 6A to Figure 6F It is a process cross-sectional view explaining the manufacturing method of the component according to this embodiment.

[0132] (step 2a)

[0133] First, if Figure 6A As shown, using a substrate 10 formed of nickel (Ni) on one surface, an alloy film 11 containing silver (Ag), tin (Sn) and copper (Cu) is formed on the one surface by a sputtering method. (Process B1).

[0134] use as figure 2 In the shown device, a cathode electrode 60 and an anode electrode 70 are opposed to each other in a space of a reduced pressure atmosphere, and a DC pulse is applied to the cathode electrode 60 when the alloy film 11 is formed on one surface of the su...

Embodiment 1

[0150] Examples performed to confirm the effects of the present invention will be described.

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Abstract

This component manufacturing method sequentially comprises at least: a step (A1) of forming, by sputtering, an alloy film having tin as a principal component on one surface of a substrate, using a substrate in which one surface comprises nickel; a step (A3) of placing a component, in which at least a portion that comes into contact with the alloy film comprises copper or comprises nickel-coated aluminum, on the alloy film; and a step (A4) of applying heat treatment in order to bond the substrate and the alloy film to each other and the alloy film and the component to each other. In step (A1), a cathode electrode and an anode electrode are arranged opposite each other in a space having a reduced-pressure atmosphere, the cathode electrode being provided with an alloy target having tin as a principal component, and the anode electrode being provided with the substrate; and a DC voltage is applied to the cathode electrode when the alloy film is being formed on the aforementioned one surface of the substrate.

Description

technical field [0001] The present invention relates to a method of manufacturing a component and the component. More specifically, the present invention relates to a method of manufacturing a component capable of reducing the cost and thickness by reducing the thickness of the solder layer while ensuring mechanical and electrical properties, and the component. [0002] This application claims priority based on Japanese Patent Application No. 2011-177893 for which it applied in Japan on August 16, 2011, and uses the content here. Background technique [0003] Solder materials such as Sn-Pb (tin-lead) alloy and Sn-Au (tin-gold) alloy are used for mounting semiconductor devices and the like. In particular, in Sn-based solder, the tin component diffuses significantly into electrode layers such as aluminum, which greatly affects the reliability of solder joints. Thus, when Sn-based solder is used, the solder layer is not directly formed on the electrode layer of the base, but ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/60C23C14/06C23C14/34
CPCC23C14/165H01L24/741H01L2224/32013H01L2224/32106H01L2224/741H01L2224/83002H01L24/03H01L24/05H01L24/27H01L24/29H01L24/32H01L24/743H01L24/83H01L2224/0345H01L2224/04026H01L2224/05655H01L2224/2745H01L2224/291H01L2224/29111H01L2224/32245H01L2224/32503H01L2224/83447H01L2224/83455H01L2224/8381H01L2224/83815H01L2224/83011H01L2224/8302H01L24/74H01L2224/74H01L2224/40499H01L24/37H01L24/40H01L24/41H01L24/77H01L24/84H01L2224/04034H01L2224/37124H01L2224/37147H01L2224/4051H01L2224/4111H01L2224/37655H01L2224/37565H01L2224/40507H01L2224/4052H01L2224/84002H01L2224/84011H01L2224/8402H01L2224/8481H01L2224/84815H01L2224/03H01L2924/00014H01L2924/014H01L2924/01047H01L2924/01029H01L2924/0103H01L2924/01083H01L2924/01049H01L2924/0105H01L2224/743H01L2224/404H01L2224/77H01L2924/01051H01L2924/01028C23C14/06C23C14/34
Inventor 中牟田雄松本昌弘稻垣贵之平松大典谷典明
Owner ULVAC INC
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