Graphene foam film enhanced heat-conducting gasket and preparation method thereof

A graphene foam and thermally conductive gasket technology, which is applied in the fields of thermal conductivity, thermal management materials, heat dissipation, and thermally conductive interface materials, can solve the problems of high hardness of thermally conductive gaskets, increased thermal resistance of gasket applications, thermal failure, etc., and achieves good results. Compressibility and compression resilience, ensure mechanical properties, and improve the effect of resilience

Pending Publication Date: 2021-08-24
CHANGZHOU FUXI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Although the graphene heat conduction film used in the above two methods has a higher thermal conductivity, the densified structure of the graphene heat conduction film leads to a higher hardness of the heat conduction gasket, and a significant increase in the application thermal resistance of the gasket. ; At the same time, the resulting thermal pad has no pores and poor compression resilience, and cannot play the effect of filling the thermal interface
The graphite-like structure inside the graphene thermal film is easy to cause delamination, which not only affects the overall mechanical stability, but also has the risk of cracking; it will also cause serious consequences of thermal failure under high temperature, high humidity, severe cold, long-term use conditions, etc.
In addition, the surface of the graphene thermal conductive film is smooth, and often requires rough surface treatment, such as nano-coating or rough grinding, in order to achieve a good combination with the adhesive; and coating requires at least two more thermal resistance interfaces. , and there is a risk of thermal failure under long-term aging conditions; surface grinding will lead to a decrease in mechanical properties, and it cannot meet the performance requirements of compression and rebound

Method used

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  • Graphene foam film enhanced heat-conducting gasket and preparation method thereof
  • Graphene foam film enhanced heat-conducting gasket and preparation method thereof
  • Graphene foam film enhanced heat-conducting gasket and preparation method thereof

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0080] In this embodiment, the graphene foam film accounts for 60wt.%, and the liquid silica gel 40wt.%.

[0081] Graphene foam film thermal conductivity 50W / (m K);

[0082] Graphene foam film thickness 50μm, density 0.1g / cm 3 ;

[0083] The average pore diameter of the internal pores of the graphene foam film is 10 μm, the pore diameter of the upper and lower through holes is 50 μm, and the center distance of the through holes is 300 μm;

[0084] The liquid silica gel is polydimethylcyclosiloxane, which is diluted with heptane to a viscosity of 1000mPa·s;

[0085] Curing temperature 150°C;

[0086] After testing, the porosity of the sample is 90%, and the thermal conductivity is 29W / (m K). The application thermal resistance and compression resilience of samples with different thicknesses are as follows:

[0087]

Embodiment 2

[0089] In this embodiment, the graphene foam film accounts for 95wt.%, and the liquid silica gel 5wt.%;

[0090] Graphene foam film thermal conductivity 460W / (m K);

[0091] Graphene foam film thickness 1000μm, density 0.9g / cm 3 ;

[0092] The average pore diameter of the internal pores of the graphene foam film is 100 μm, the pore diameter of the upper and lower through holes is 500 μm, and the center distance of the through holes is 1000 μm;

[0093] The liquid silica gel is polydimethylsiloxane, which is diluted with hexane to a viscosity of 30mPa·s;

[0094] Curing temperature 120°C;

[0095] After testing, the porosity of the sample is 50%, and the thermal conductivity is 326W / (m K). The application thermal resistance and compression resilience of samples with different thicknesses are as follows:

[0096]

Embodiment 3

[0098] In this embodiment, the graphene foam film accounts for 75wt.%, and the liquid silica gel 25wt.%.

[0099] Graphene foam film thickness 300μm, density 0.2g / cm 3 ;

[0100] The thermal conductivity of the graphene foam film is 102W / (m K);

[0101] The average pore diameter of the internal pores of the graphene foam film is 15 μm, the pore diameter of the upper and lower through holes is 100 μm, and the center distance of the through holes is 400 μm;

[0102] The liquid silica gel is α, ω-dihydroxy polydimethylsiloxane, which is diluted with tetrahydrofuran to a viscosity of 100mPa·s;

[0103] Curing temperature 80°C;

[0104] After testing, the porosity of the sample is 84%, and the thermal conductivity is 76W / (m K). The application thermal resistance and compression resilience of samples with different thicknesses are as follows:

[0105]

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Abstract

The invention discloses a graphene foam film enhanced heat-conducting gasket and a preparation method thereof. The graphene foam film enhanced heat-conducting gasket comprises a plurality of layers of graphene foam films and adhesives filled in the graphene foam films and among the layers, and the graphene foam films account for 60-95 wt% of the total weight of the heat-conducting gasket. The graphene is arranged in the heat-conducting gasket in the thickness direction, and the gasket has good heat-conducting performance in the thickness direction; besides, the combination of the graphene foam film and the adhesive has good compressibility and compression resilience, and the application thermal resistance is small.

Description

technical field [0001] The invention relates to the fields of heat conduction, heat dissipation, heat management materials, heat conduction interface materials, etc., and particularly relates to graphene-enhanced heat conduction pads. Background technique [0002] Thermal pad is a kind of thermal conductive material, which is mainly used in the transfer interface between electronic equipment and heat sink or product shell. Graphene has good thermal conductivity and can be used as a reinforcement material for thermal pads. There are two main ways to use graphene thermally conductive film-enhanced thermally conductive gaskets: one is to stack and bond the graphene thermally conductive film layer by layer with an adhesive, and then cut it into thermally conductive gaskets so that the graphene thermally conductive film is aligned along the thickness direction. Arrangement, such as patent document WO2019235983A1; the second is to change the graphene heat conduction film from the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B9/00B32B9/04B32B7/12B32B37/12B32B38/04H05K7/20
CPCB32B5/18B32B5/32B32B7/12B32B37/12B32B38/04H05K7/2039B32B2266/04B32B2307/302B32B2307/51B32B2260/02B32B2260/046
Inventor 葛翔李峰李壮周步存
Owner CHANGZHOU FUXI TECH CO LTD
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