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Transfer method of thin film plated with ultrathin metal nanomaterial on base

A technology of material thin film and ultra-thin metal, which is applied in the field of thin film materials, can solve problems such as no way to separate, limit the application of monomolecular thin films, and depend on single molecular thin films

Inactive Publication Date: 2014-01-29
SHAANXI NORMAL UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The disadvantage of the Moffat method is that a gold-plated silicon wafer is used as the substrate. After the platinum deposition is completed, the platinum is naturally combined with the gold, and there is no way to separate it.
[0006] However, another disadvantage of the above method is that the prepared monomolecular film depends on the substrate and cannot be effectively transferred to other substrates, which limits the application of monomolecular films.

Method used

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  • Transfer method of thin film plated with ultrathin metal nanomaterial on base
  • Transfer method of thin film plated with ultrathin metal nanomaterial on base

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] Taking the transfer method coated with a platinum film on an aluminum foil substrate as an example, the steps are as follows:

[0027] The method of plating platinum film on the aluminum foil substrate is as follows: put the conductive substrate of aluminum foil with a thickness of 0.3 mm into the preparation vessel 1 and use it as the first electrode 2, and the platinum sheet conductive electrode as the second electrode 3, and the first electrode 2 The distance between the second electrode 3 and the second electrode 3 is 5cm, and the K of 3mM is added in the preparation vessel 1 2 PtCl 6 aqueous solution and 1.5M NaCl, K 2 PtCl 6 The molar ratio of sodium chloride to sodium chloride is 1:500, prepared as a deposition solution, the amount of the deposition solution is added to immerse the flexible and curled aluminum foil conductive substrate, adjust the pH value to 4, heat to 25°C, turn on the power, and the voltage is - 0.60V, deposit a single atomic layer thick pl...

Embodiment 2

[0037]Taking the transfer method coated with a platinum film on an aluminum foil substrate as an example, the steps are as follows:

[0038] Step 1 is the same as in Example 1. In step 2, the ethylene-vinyl acetate copolymer adhesive film and the aluminum foil substrate stuck together are placed in an aqueous hydrochloric acid solution with a concentration of 0.001 mol / L. After the aluminum foil substrate is completely eliminated, the platinum film is transferred to the Ethylene-vinyl acetate copolymer film.

Embodiment 3

[0040] Taking the transfer method coated with a platinum film on an aluminum foil substrate as an example, the steps are as follows:

[0041] Step 1 is the same as in Example 1. In step 2, the ethylene-vinyl acetate copolymer adhesive film and the aluminum foil substrate stuck together are placed in an aqueous hydrochloric acid solution with a concentration of 0.05 mol / L. After the aluminum foil substrate is completely eliminated, the platinum film is transferred to the Ethylene-vinyl acetate copolymer film.

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Abstract

The invention relates to a transfer method of thin film plated with an ultrathin metal nanomaterial on a base. The method comprises the following steps: placing a high molecular coating on a metal nanomaterial thin film prepared on the base, wherein thickness is less than 10 atomic layers, heating till the high molecular coating is adhered to the base, and naturally cooling to room temperature; placing the high molecular coating and the base adhered in acid or alkali; after the base is eliminated completely, transferring the nanomaterial thin film to the high molecular coating. In the embodiment I, a platinum thin film plated on an aluminum foil base is transferred to a sample of an ethylene-vinyl acetate copolymer coating with the average molecular weight of 2000. The platinum thin film is tested by an atomic force microscope and an X-ray photoelectron spectrometer. Photographs shot by the atomic force microscope show that the platinum thin film is uniformly distributed on the high molecular coating and is 0.3nm in size. The X-ray photoelectron spectroscopy shows that the platinum thin film exists on the ethylene-vinyl acetate copolymer coating with the average molecular weight of 2000.

Description

technical field [0001] The invention belongs to the technical field of thin film materials, and in particular relates to transferring thin film materials plated on a substrate to another substrate. Background technique [0002] Ultra-thin nanomaterials, especially nanomaterials with a thickness less than 10 atomic layers, such as graphene, chemically modified graphene and its derivatives, noble metal films, such as Pt, Pd, Au, Ag, Cu, etc., \, oxides Thin films such as zinc oxide films, nitride films such as boron nitride, etc., have very unique properties and have attracted extensive research interest. Strictly speaking, graphene is a two-dimensional carbon film with a thickness of one atomic layer. Graphene's room temperature electron mobility far exceeds that of all other known species, the highest Young's modulus and mechanical strength. Graphene is a million times more stable than copper at high current densities. It is the best gas, water vapor and chemical vapor bar...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08J7/00C08J5/12C08L23/08
Inventor 刘生忠马强訾威朱学杰刘晓静
Owner SHAANXI NORMAL UNIV