Method and device for detecting surface defects and thickness of semiconductor sheet material

A technology of thickness detection and detection method, applied in the direction of measuring device, using optical device, optical testing defect/defect, etc., can solve the problems of large influence of impurities and pollution, poor repeatability, unsuitable thickness of film, etc., to achieve repeatability High, easy to operate, low sample requirements

Active Publication Date: 2014-01-29
CHINA UNIV OF MINING & TECH
View PDF8 Cites 15 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to solve the problems existing in the detection of surface defects and thickness of semiconductor sheets, and propose a method and device for detecting surface defects and thickness of semiconducto

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method and device for detecting surface defects and thickness of semiconductor sheet material
  • Method and device for detecting surface defects and thickness of semiconductor sheet material
  • Method and device for detecting surface defects and thickness of semiconductor sheet material

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0039] Embodiment 1: The present invention has a detection method and a solution to the device. The detection device includes a tool 1, a control cabinet 2, a computer 3, and a connecting cable 4. The tool 1, the control cabinet 2 and the computer 3 are sequentially connected by the connecting cable 4 . figure 1 , figure 2 , image 3 with Figure 4 The solution of the detection method and device of the present invention is explained.

[0040] The tooling 1 includes: control panel 1-1, laser generator 1-9, laser receiver 1-10, test platform 1-12, protection device 1-13, synchronous operation system 1-15, test platform support and Level adjustment system 1-16, power system 1-17 and bottom plate 1-19. All components of tooling 1 are installed on the bottom plate 1-19. The control panel 1-1 is connected to the front of tooling 1, and the laser generator 1-9, laser receiver 1-10 and test platform are connected to the upper end of tooling 1. 1-12 and protection device 1-13, the sync...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention provides a method and a device for detecting surface defects and thickness of a semiconductor sheet material and belongs to the method and the device for detecting the surface defects and the thickness of materials. According to the specific technical scheme adopted by the device, the device comprises a tool, a control cabinet, a computer and a connection cable, wherein the tool, the control cabinet and the computer are connected in sequence by the connection cable. The detection principle of the device is as follows: a green laser transmission principle is used for indirectly feeding back a height value signal of a plane sheet material and the surface defects and the thickness of the semiconductor sheet material are calculated by a series of formulas. The detection method comprises the following steps: a testing platform horizontal correction method, a synchronous operation method for a laser generator and a laser receiver, the detection method for the surface defects and the thickness of the semiconductor sheet material, a calculation method for the surface defects and the thickness of the semiconductor sheet material. The detection device is simple and practical, easy to operate, high in detection precision, good in repeatability, low in sample requirements and small in impurity and pollution influences, and is very suitable for scientific research requirements.

Description

technical field [0001] The invention relates to a method and device for detecting surface defects and thickness of materials, in particular to a method and device for detecting surface defects and thickness of semiconductor sheets. Background technique [0002] With the advancement of technology, semiconductors have been widely used in people's daily life. Due to the high requirements on the surface of the semiconductor sheet, its surface defects and thickness have a great influence on the subsequent preparation process and performance. Warpage changes, local hard spots, etc. before and after annealing can effectively improve the performance and efficiency of semiconductor sheets, and provide technical support for process improvement; at the same time, direct contact is generally not suitable for testing semiconductor sheets, so as not to cause semiconductor Scratches and contamination. At present, non-contact measurement methods include capacitance method, optical reflect...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): G01N21/88G01B11/06
Inventor 黄飞闫爱华赵辉廖振华尹诗斌强颖怀张绍良
Owner CHINA UNIV OF MINING & TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap