Cu-Ni-Si copper alloy sheet with excellent deep drawability and process for producing same

Abstract

A Cu-Ni-Si-based copper alloy plate containing 1.0 to 3.0% by mass of Ni, and containing Si at a concentration of 1 / 6 to 1 / 4 of the concentration of Ni by mass %, with the balance being Cu and unavoidable impurities , the arithmetic average roughness Ra of the surface is 0.02-0.2 μm, and the standard deviation of the absolute value of each peak value and valley value is less than 0.1 μm based on the average surface roughness line. The vertical and horizontal dimensions of the grains in the alloy structure The average value of the ratio is 0.4 to 0.6. When the orientation of all pixels within the measurement area is measured according to the EBSD method, and the boundary between adjacent pixels with an orientation difference of 5° or more is regarded as a grain boundary, The average value of all grains of GOS is 1.2-1.5°, the ratio of the total length Lσ of special grain boundaries to the total length L of grain boundaries (Lσ / L) of special grain boundaries is 60-70%, and the elastic limit The value is 450 to 600 N / mm2, and the solder heat peeling resistance at 150°C for 1000 hours is good, the variation in fatigue resistance is small, and it has excellent deep drawability.

Description

technical field [0001] The present invention relates to a Cu-Ni-Si-based copper alloy plate and a manufacturing method thereof. The Cu-Ni-Si-based copper alloy plate can maintain a balance between deep drawing workability, solder heat peeling resistance, and elastic limit value. It has little change in fatigue resistance and has excellent deep drawability, making it suitable for use in electrical and electronic components. [0002] This application claims the priority based on the international application PCT / JP2011 / 062028 for which it applied on May 25, 2011, and uses the content here. Background technique [0003] With the lightness, thinner and shorter of electronic equipment in recent years, terminals and connectors are also developing in the direction of miniaturization and thinning, and strength and bending workability are required, so as to replace the conventional solid-solution strengthening such as phosphor bronze or brass The demand for precipitation-strengthene...

AI Technical Summary

Problems solved by technology

[0013] The deep drawability of conventional Cu-Ni-Si based Corson alloys is not sufficient, and the balance between deep drawability, solder heat peeling resistance and elastic limit value is poor, and the variation (deviation) of fatigue resistance characteristics Large, often hinders the application as an electronic component material that is exposed to severe operating environments in high temperature and high vibration for a long time

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