Lightweight inorganic insulation board containing silica aerogel and preparation method thereof

Abstract

The invention discloses a lightweight inorganic insulation board containing silica aerogel and a preparation method thereof. The preparation method comprises the following steps: a. preparing surfactant liquid: fully stirring a surfactant and water to prepare a uniform surfactant liquid for standby use; b. preparing powder: fully mixing cement, ash calcium, aerogel, light aggregate fillers, fibers and latex powder and stirring uniformly to prepare powder for standby use; c. preparing the inorganic insulation board: adding the uniformly mixed powder to the surfactant liquid within 5-10 minutes through stirring, then filling the slurry into a die for forming and curing at normal temperature, thus obtaining the final product. Compared with the traditional inorganic insulation boards and insulation boards containing non-silica aerogel, the prepared inorganic insulation board containing silica aerogel has the characteristics of short production cycle, simple and controllable process and low price, has good heat insulation property and effectively solves the problems of high heat conductivity coefficients and higher water absorption of conventional inorganic insulation boards, and the heat conductivity coefficient of the inorganic insulation board can be reduced by 10-30%.

Description

technical field [0001] The invention belongs to the field of building materials, and in particular relates to an inorganic lightweight insulation board containing silica airgel and a preparation method thereof, which can be prepared at normal temperature without special constant temperature and pressure equipment, and the prepared inorganic insulation board Compared with the traditional inorganic insulation board, the thermal conductivity is reduced by 10~30%, and it has better thermal insulation performance. Background technique [0002] At present, the thermal insulation boards on the market are divided into inorganic thermal insulation boards and organic thermal insulation boards. Among them, inorganic thermal insulation boards are low in cost and have a large application market. However, due to the high thermal conductivity and large weight of inorganic thermal insulation boards, the use effect is seriously affected. . [0003] Invention patent CN10279586A discloses a m...

AI Technical Summary

Problems solved by technology

[0002] At present, the thermal insulation boards on the market are divided into inorganic thermal insulation boards and organic thermal insulation boards. Among them, inorganic thermal insulation boards are low in cost and have a large application market. However, due to the high thermal conductivity and large weight of inorganic thermal insulation boards, the use effect is seriously affected.

[0003] Invention patent CN10279586A discloses a method for preparing an airgel-containing inorganic lightweight aggregate composite thermal insulation material. Since the material does not have cement, the surface of the board prepared from this material does not have the strength of cement. Although this method Silica airgel is used, but the preparation process requires constant temperature and constant pressure, the process is complex, and steps such as gelling, aging, and drying are required, and the production process takes a long time and costs high